VLSI KoreaAdvantest V93000
A scalable SoC automated-test platform.
1 sources · researched · 0 connectionsTHE CONNECTED COLLECTION
The semiconductor reference library
Architecture is a relationship, not a specification label. Follow companies, instruction sets, cores, processes, packages and source documents into the objects they explain.
Architectures
2x Zen 4 , 4x Zen 4c14004165021800828080298086308018610280286378048679A171A182A192Browse all →Process labels
0.5 µm90.6 µm10.8 µm80.13 µm40.15 µm10.18 µm320.25 or 0.35um80.25 µm850.35 µm20.75 µm11 µm141.5 µm43Browse all →Companies
Intel7,480STMicroelectronics2,117AMD1,254Freescale755Zilog649MSI634ASUS581Gigabyte449Rockwell296CMD290EVGA263National Semiconductor246Browse all →Applied Materials Catalyst CMP
Applied's CMP solution described for controlling copper dishing ahead of hybrid-bond annealing.
1 sources · researched · 0 connectionsApplied Materials Mirra CMP
A 150/200 mm CMP family with integrated post-CMP cleaning options.
1 sources · researched · 0 connectionsApplied Materials Producer CVD
A CVD platform for semiconductor film deposition across logic, DRAM, NAND and specialty applications.
1 sources · researched · 0 connectionsASM Intrepid ES
ASM's epitaxy tool for critical 300 mm transistor and memory applications.
1 sources · researched · 0 connectionsASML TWINSCAN NXE:3600D
ASML's 0.33-NA EUV scanner for 300 mm wafer exposure.
1 sources · researched · 0 connectionsAxcelis Purion XE Series
A high-energy ion-implant family using RF LINAC beamline technology.
1 sources · researched · 0 connectionsCanon FPA-5520iV
An i-line stepper for advanced-packaging lithography.
1 sources · researched · 0 connectionsDISCO DAD3220
A single-spindle automatic dicing saw. DISCO marks production of this model as ended.
1 sources · researched · 0 connectionsEUV lithography
EUV lithography transfers patterns using light with a wavelength of 13.5 nm. EUV systems print selected intricate layers; DUV systems remain part of the same manufacturing flow. Light wavelength should not be confused with a process node label or the final printed feature size.
1 sources · researched · 1 connectionsEVG GEMINI FB
An automated system for collective die-to-wafer fusion and hybrid bonding in high-volume manufacturing.
1 sources · researched · 0 connectionsHitachi High-Tech GS1000
An electron-beam inspection/metrology system for wide-area semiconductor inspection.
1 sources · researched · 0 connectionsKLA Surfscan SP2XP
KLA's unpatterned-wafer inspection system, documented for 45 nm generation requirements.
1 sources · researched · 0 connectionsLam Research Kiyo
Lam's conductor-etch family for electrically active device materials.
1 sources · researched · 0 connectionsNikon NSR-S635E
A 300 mm ArF immersion scanner with 1.35 NA.
1 sources · researched · 0 connectionsNova VeraFlex IV LE-XRF
An in-line materials-metrology tool combining XPS and low-energy XRF.
1 sources · researched · 0 connectionsOnto Innovation Firefly G5
A panel-level packaging system combining automated inspection and 3D metrology.
1 sources · researched · 0 connectionsSCREEN LA-3100
A flash-lamp annealer for millisecond thermal-dose control.
1 sources · researched · 0 connectionsSCREEN SU-3400
A 300 mm single-wafer cleaner with a 24-chamber configuration.
1 sources · researched · 0 connectionsSemiconductor metrology & inspection
Semiconductor metrology measures process features, while inspection looks for defects and other deviations. Applied Materials describes applications across FEOL and BEOL. A microscope image needs its method and specimen context before dimensions or failure mechanisms can be inferred.
1 sources · researched · 1 connectionsTEL CLEAN TRACK LITHIUS Pro Z
TEL's 300 mm coater/developer for 10 nm and beyond process flows.
1 sources · researched · 0 connectionsTeradyne UltraFLEXplus
A configurable semiconductor test platform with digital, RF, AC and DC instruments.
1 sources · researched · 0 connectionsVeeco Lumina MOCVD
A Veeco MOCVD system based on TurboDisc technology for compound-semiconductor epitaxy.
1 sources · researched · 0 connectionsDates and historical archive claims retain their original capture context. A process marketing name is not a measured feature dimension.
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