VLSI Korea

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The semiconductor reference library

Architecture is a relationship, not a specification label. Follow companies, instruction sets, cores, processes, packages and source documents into the objects they explain.

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Architectures

2x Zen 4 , 4x Zen 4c14004165021800828080298086308018610280286378048679A171A182A192Browse all →

Process labels

0.5 µm90.6 µm10.8 µm80.13 µm40.15 µm10.18 µm320.25 or 0.35um80.25 µm850.35 µm20.75 µm11 µm141.5 µm43Browse all →

Companies

Intel7,480STMicroelectronics2,117AMD1,254Freescale755Zilog649MSI634ASUS581Gigabyte449Rockwell296CMD290EVGA263National Semiconductor246Browse all →
packaging technology

Hybrid bonding & TSMC SoIC

SoIC is TSMC’s platform for integrating chiplets in three dimensions. Its chiplet integration is distinct from a photograph of a finished package: the bonded interfaces and internal connections require their own evidence. The source explains wafer-on-wafer and chip-on-wafer integration options.

1 sources · researched · 0 connections

Dates and historical archive claims retain their original capture context. A process marketing name is not a measured feature dimension.

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