VLSI KoreaApple M1 Ultra UltraFusion package
Apple packaging architecture joining two M1 Max dies with a silicon interposer.
1 sources · structured · 2 connectionsTHE CONNECTED COLLECTION
The semiconductor reference library
Architecture is a relationship, not a specification label. Follow companies, instruction sets, cores, processes, packages and source documents into the objects they explain.
Architectures
2x Zen 4 , 4x Zen 4c14004165021800828080298086308018610280286378048679A171A182A192Browse all →Process labels
0.5 µm90.6 µm10.8 µm80.13 µm40.15 µm10.18 µm320.25 or 0.35um80.25 µm850.35 µm20.75 µm11 µm141.5 µm43Browse all →Companies
Intel7,480STMicroelectronics2,117AMD1,254Freescale755Zilog649MSI634ASUS581Gigabyte449Rockwell296CMD290EVGA263National Semiconductor246Browse all →LQFP48
48-pin low-profile quad flat package listed for GD32F103CBT6. This is a package class, not a unique die.
1 sources · structured · 1 connectionsDates and historical archive claims retain their original capture context. A process marketing name is not a measured feature dimension.
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