VLSI KoreaApple identifies UltraFusion as the package architecture of M1 Ultra.
Apple · EvidencePACKAGE
Apple M1 Ultra UltraFusion package
Apple packaging architecture joining two M1 Max dies with a silicon interposer.
UltraFusion package
Specifications
2 SOURCE-LINKED FIELDS| Packaging, power & physical analysis | |
|---|---|
| Die count | Manufacturer / primary sourceApple Scope: M1 Ultra package Source date: 2022-03-08 Two M1 Max dies. |
| Additional specifications | |
| Interconnect medium | Manufacturer / primary sourceApple Scope: M1 Ultra package Source date: 2022-03-08 Apple identifies a silicon interposer; no additional package construction is inferred. |
THE VISUAL EVIDENCE
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2 SOURCE-LINKED RELATIONSHIPSMultiplicity: 2 M1 Max dies.
Apple · EvidenceSources and historical context
Apple unveils M1 Ultra, the world’s most powerful chip for a personal computer
Apple · official-disclosure · live-verified