VLSI MUSEUM / Semiconductor encyclopedia

Chip database

Part numbers, architecture, source-linked specifications and real product photography. A reference desk for semiconductor research.

Records: 20,390
Source-linked fields: 281,415
Photographed records: 247

TRYAMD · 8+ cores · ≤65 W Exynos 2600 Die shots ↗Visual sources ↗

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AMD Ryzen 5 3600 — Zen 2 / Matisse CCD — AMD Zen 2 CCD · FritzchensFritz · CC0

Intel 8086 CPU die — Intel 8086 · Pdesousa359 · CC BY-SA 3.0

NVIDIA GeForce 256 · NV10 — Optical die photograph — NVIDIA GeForce 256 · NV10 · Fritzchens Fritz from Berlin · CC0

01 — 03 REAL DIE PHOTOGRAPHS · SOURCE LINKED

RESEARCH PATHS · MATERIALS TO PACKAGING

Beyond the die shot.

New material, wafer, transistor and packaging records. Every image retains its creator and reuse license.

All new records →

waferSilicon wafer deviceGate-all-around transistor equipmentEUV lithography packaging technologyHybrid bonding & TSMC SoIC memory technologyHigh-bandwidth memory devicePlanar MOSFET structure

THE REAL THING

Now, look inside.

Real specimens. Documented histories. Every photograph with its source.

All photographs

001 / DIE PHOTOGRAPH

AMD Ryzen 5 3600 — Zen 2 / Matisse CCD

AMD2019

AMD Zen 2 CCD

Zen 2

FritzchensFritz ·CC0

002 / PACKAGE PHOTOGRAPH

Intel P4004 processor package

Intel 4004

P4004

Thomas Nguyen ·CC BY-SA 4.0

003 / DIE PHOTOGRAPH

Intel 8086 CPU die

Intel 8086

i8086

Pdesousa359 ·CC BY-SA 3.0

Follow your curiosity.

01Companies 02Architectures & ideas 03Evidence & sources

20,390 records to explore. One open collection.