Apple M1 Ultra UltraFusion package

Apple packaging architecture joining two M1 Max dies with a silicon interposer.

UltraFusion package

사양

2 SOURCE-LINKED FIELDS

Packaging, power & physical analysis
Die count	Manufacturer / primary sourceApple Scope: M1 Ultra package Source date: 2022-03-08 Two M1 Max dies.
Additional specifications
Interconnect medium	Manufacturer / primary sourceApple Scope: M1 Ultra package Source date: 2022-03-08 Apple identifies a silicon interposer; no additional package construction is inferred.

Packaging, power & physical analysis

Die count

Manufacturer / primary sourceApple

Scope: M1 Ultra package

Source date: 2022-03-08

Two M1 Max dies.

Additional specifications

Interconnect medium

Manufacturer / primary sourceApple

Scope: M1 Ultra package

Source date: 2022-03-08

Apple identifies a silicon interposer; no additional package construction is inferred.

THE VISUAL EVIDENCE

0 개의 확인된 출처

이 기록의 신뢰할 수 있는 공개 시각 자료는 아직 확인하지 못했습니다. 다이 사진·패키지 이미지·논문·제조사 도해를 제안할 수 있습니다.

2 SOURCE-LINKED RELATIONSHIPS

적용 제품Apple M1 Ultraproduct family

Apple identifies UltraFusion as the package architecture of M1 Ultra.

Multiplicity: 2 M1 Max dies.

Apple · official-disclosure · live-verified