VLSI KoreaEQUIPMENT
Applied Materials Catalyst CMP
Applied's CMP solution described for controlling copper dishing ahead of hybrid-bond annealing.
Catalyst CMP
Specifications
3 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Process application | Manufacturer / primary sourceApplied Materials Scope: tool-family Source date: 2023-07-10 |
| Process application | Manufacturer / primary sourceApplied Materials Scope: tool-family Source date: 2023-07-10 |
| Additional specifications | |
| Controlled characteristic | Manufacturer / primary sourceApplied Materials Scope: tool-family Source date: 2023-07-10 |
THE VISUAL EVIDENCE
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Sources and historical context
Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
Applied Materials · official-disclosure · source linked