SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

23 recordsSort

equipment

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	EUV lithographyASML · concept	unresearched	unresearched	unresearched	unresearched
	Semiconductor metrology & inspectionApplied Materials · concept	unresearched	unresearched	unresearched	unresearched

lithography

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	ASML TWINSCAN NXE:3600DASML · tool model	300 mm EUV exposureProcess application	unresearched	unresearched	0.33 NAProjection numerical aperture

deposition

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	Applied Materials Producer CVDApplied Materials · tool family	dielectric, SiGe and amorphous-silicon filmsProcess application	unresearched	unresearched	unresearched

CMP

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	Applied Materials Mirra CMPApplied Materials · tool family	silicon, STI oxide, polysilicon, tungsten and Cu planarizationProcess application	unresearched	unresearched	unresearched

bonding surface preparation

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	Applied Materials Catalyst CMPApplied Materials · tool family	copper hybrid-bonding surfacesProcess applicationConflicting observations	unresearched	unresearched	unresearched

etch

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	Lam Research KiyoLam Research · tool family	conductor etch for transistor, interconnect and memory structuresProcess application	unresearched	unresearched	unresearched

coat/develop

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	TEL CLEAN TRACK LITHIUS Pro ZTokyo Electron · tool model	advanced immersion and EUV lithographyProcess application	unresearched	300 mmWafer diameter	unresearched

inspection

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	KLA Surfscan SP2XPKLA · tool model	prime, SOI, epitaxial and engineered bare wafersProcess application	unresearched	unresearched	unresearched

epitaxy

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	ASM Intrepid ESASM · tool model	300 mm advanced transistor and memory layersProcess application	unresearched	unresearched	unresearched

cleaning

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	SCREEN SU-3400SCREEN Semiconductor Solutions · tool model	300 mm single-wafer cleaningProcess application	unresearched	unresearched	1200 wafers/hourMaximum throughput

thermal processing

Capabilities apply to the named tool or family and the source’s configuration. Vendor throughput is not an independent benchmark. Missing fields are unresearched; conflicting observations remain visible.
Compare	Tool / family	Process application	Technology / method	Wafer / substrate	Capability
	SCREEN LA-3100SCREEN Semiconductor Solutions · tool model	dopant activation and low-thermal-budget annealProcess application	unresearched	unresearched	Wafer-temperature measurement during irradiationMeasurement capability