VLSI Korea
Workload and traffic model
Build a traffic matrix across the documented CPU, graphics, AI and I/O engines. Model concurrent bursts, locality and worst-case response time at shared memory before choosing arbitration or buffering.
SAMSUNG / SILICON DESIGN
Samsung Exynos 2400
The Exynos 2400 is Samsung’s ten-core 2024 flagship mobile SoC, using a third-generation 4 nm low-power node, RDNA 3-based Xclipse 940 graphics, FOWLP packaging and Release 17 5G/NTN support.
Samsung Exynos 2400 DIE PHOTOGRAPH
Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.
Origin & contributions
Original source · Retrieved 2026-09-09
Chipwise / NanoPhysics · photographer · Included in this image
Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.
Exynos 2400 die shot. See source caption; no chip layer inferred beyond source evidence
Source photography; preparation and visible markings are preserved. This photograph supplies no independently verified geometric measurements.
Specifications
36 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Year | Manufacturer / primary sourceSamsung Scope: silicon-die Year identifies first public introduction where a dated launch is available; see record notes for exceptions. |
| Process | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Foundry | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Independent analyst attribution. |
| Preview date | Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die |
| CPU & clock domains | |
| CPU cores | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| CPU topology | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| CPU configuration | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Samsung’s current table lists peak clocks with five A720 cores grouped together; device frequency tables may distinguish additional clock groups. |
| CPU prime peak | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Graphics | |
| GPU | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| GPU architecture | Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die |
| GPU core count | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Ray tracing | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| AI & security | |
| AI performance claim | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Manufacturer-reported performance; workload, precision and test conditions affect comparisons. |
| NPU configuration | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Memory & interfaces | |
| Memory | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Storage | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Camera, video & display | |
| Maximum camera resolution | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Camera sensor concurrency | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Video | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Display | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Camera processing modes | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Video modes | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Video codecs | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Codec list; not every codec is established at every listed encode/decode mode. |
| Connectivity & devices | |
| Modem standard | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Modem bands | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Modem peak downlink | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| NTN | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| GNSS | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Documented devices | Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die Device use varies by market; Samsung’s S24 FE release calls its chip an Exynos 2400-series chipset. |
| Connectivity | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
| Modem rates | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Theoretical link maxima under supported radio conditions; not an observed network speed. |
| Packaging, power & physical analysis | |
| Reported die width | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die height | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die area | Published analysisKurnal Insights Scope: silicon-die Kurnal’s original die-shot entry reports 10.61 × 12.95 mm and 137.4 mm². Samsung does not publish die area. |
| Verified die geometry | UnconfirmedSamsung Scope: silicon-die No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled. |
| Packaging | Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die |
Source-linked recordEditorial update
ARCHITECTURE → RTL → GDS
All design guides ↗Design with this record
Start with documented specifications, then use the study prompts below. The prompts are engineering guidance, not a claim about this product’s private RTL or physical implementation.
- CPU cores
- Samsung Semiconductor ↗
- Process
- Samsung Semiconductor ↗
- Memory
- Samsung Semiconductor ↗
- Storage
- Samsung Semiconductor ↗
- NPU configuration
- Samsung Semiconductor ↗
- Reported die area
- Kurnal Insights ↗
Contracts before RTL
Choose a representative producer/consumer path and specify acceptance, ordering, backpressure, outstanding capacity and reset recovery. Turn these contracts into assertions and test scenarios before optimizing the datapath.
A feasible physical plan
Obtain macro abstracts, pin maps, timing libraries and activity-based power estimates. Explore macro proximity, routing channels and power-grid reachability together. An annotated die photograph can suggest study questions, but cannot supply a netlist, PDK or signoff constraints.
Read the record in its physical scope.
The Exynos 2400 is Samsung’s ten-core 2024 flagship mobile SoC, using a third-generation 4 nm low-power node, RDNA 3-based Xclipse 940 graphics, FOWLP packaging and Release 17 5G/NTN support.
This record has identification and source evidence. A deeper architectural article has not yet been written. Visible patterns alone do not establish block functions, capacity or an internal protocol.
Follow the connections
2 SOURCE-LINKED RELATIONSHIPSProduct-series membership; does not assert shared masks or identical silicon.
Samsung · EvidenceSamsung footnotes identify Exynos 2400 as predecessor.
Samsung · EvidenceTHE VISUAL EVIDENCE
3 DOCUMENTED SOURCESVisual sources
Die photographs shared by their authors on X. Open a post to explore its images and discussion.
Die photograph · X
Samsung Exynos 2400 (E9945) Dieshot Layout
Hosted image provenance · 2
Die photographHosted in Museum
Samsung Exynos 2400 — Die photograph
Chipwise / NanoPhysics
1,200 × 985 pxTechnical archive / analysis
Exynos 2400 die shot. Frontside die view, as identified by source
View original die photoRights, provenance & link history
- Rights status
- PERMISSION GRANTED
- Local hosting / thumbnails / hotlinking
- Allowed / Allowed / Not enabled
- Attribution
- Image courtesy of Chipwise · Used with permission
- Identity / confidence
- matched / high
- Evidence reviewed
- 2026-09-09
- Link checked
- 2026-09-09 · ok · HTTP 200
Access to a source does not grant permission to reproduce its images.
Die photographHosted in Museum
Samsung Exynos 2400 — Die photograph
Chipwise / NanoPhysics
1,200 × 986 pxTechnical archive / analysis
Exynos 2400 die shot. See source caption; no chip layer inferred beyond source evidence
View original die photoRights, provenance & link history
- Rights status
- PERMISSION GRANTED
- Local hosting / thumbnails / hotlinking
- Allowed / Allowed / Not enabled
- Attribution
- Image courtesy of Chipwise · Used with permission
- Identity / confidence
- matched / high
- Evidence reviewed
- 2026-09-09
- Link checked
- 2026-09-09 · ok · HTTP 200
Access to a source does not grant permission to reproduce its images.
Source trail
Exynos 2400 ↗ · Samsung
Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 ↗ · Samsung
Kurnal die catalog: Samsung Exynos 2400 ↗ · Kurnal Insights
Exynos 2400 | Mobile Processor ↗ · Samsung Semiconductor
Exynos 2400 embedded Specifications ↗ · Samsung Semiconductor
Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 ↗ · Samsung Global Newsroom
Galaxy S24 Series Expands With S24 FE ↗ · Samsung Global Newsroom
Exynos 2400 (S5E9945) ↗ · Kurnal Insights
Exynos 2400 — official structured specifications ↗ · Samsung Semiconductor
Exynos 2400 die shot — Chipwise image source ↗ · Chipwise / NanoPhysics