Collection/Samsung/Samsung Exynos 2400

Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.

Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

SILICON DESIGN / 2023

Samsung Exynos 2400

The Exynos 2400 is Samsung’s ten-core 2024 flagship mobile SoC, using a third-generation 4 nm low-power node, RDNA 3-based Xclipse 940 graphics, FOWLP packaging and Release 17 5G/NTN support.

SamsungSoC

Research connections

CompanySamsung ↗SeriesSamsung Exynos ↗ArchitectureExynos 2400 ↗Process4 nm FinFET ↗

Specifications

36 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceSamsung Scope: silicon-die Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Foundry	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Independent analyst attribution.
Preview date	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die
CPU & clock domains
CPU cores	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU topology	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU configuration	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Samsung’s current table lists peak clocks with five A720 cores grouped together; device frequency tables may distinguish additional clock groups.
CPU prime peak	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Graphics
GPU	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GPU architecture	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die
GPU core count	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Ray tracing	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
AI & security
AI performance claim	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Manufacturer-reported performance; workload, precision and test conditions affect comparisons.
NPU configuration	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Memory & interfaces
Memory	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Storage	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera, video & display
Maximum camera resolution	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera sensor concurrency	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Display	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera processing modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video codecs	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Codec list; not every codec is established at every listed encode/decode mode.
Connectivity & devices
Modem standard	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem bands	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem peak downlink	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
NTN	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GNSS	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Documented devices	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die Device use varies by market; Samsung’s S24 FE release calls its chip an Exynos 2400-series chipset.
Connectivity	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem rates	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Theoretical link maxima under supported radio conditions; not an observed network speed.
Packaging, power & physical analysis
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Kurnal’s original die-shot entry reports 10.61 × 12.95 mm and 137.4 mm². Samsung does not publish die area.
Verified die geometry	UnconfirmedSamsung Scope: silicon-die No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.
Packaging	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die