VLSI MUSEUM / ENGINEERING RECORD2025

Samsung3 nm Gate-All-Around (GAA)

silicon design

The engineering record starts here.

We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.

SILICON DESIGN / 2025

Samsung Exynos 2500

Exynos 2500 moves Samsung’s flagship mobile line to 3 nm GAA and FOWLP, with a ten-core Cortex-X925-led CPU, fourth-generation Xclipse 950 graphics, 59 TOPS AI and Release 17/NTN connectivity.

SamsungSoC

Research connections

CompanySamsung ↗SeriesSamsung Exynos ↗ArchitectureExynos 2500 ↗Process3 nm Gate-All-Around (GAA) ↗

Specifications

35 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceSamsung Scope: silicon-die Source date: 2025-07-09 2025 confirmed by the dated Galaxy Z Flip7 announcement and AP specification. This is not claimed to be the first public chip announcement date.
Process	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Foundry	UnconfirmedSamsung Scope: silicon-die Source date: 2025-07-09 No foundry attribution accepted from inspected sources.
Product status	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU & clock domains
CPU cores	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU topology	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU prime core	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU prime peak	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU middle cores	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU efficiency cores	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Cpu performance claim	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Samsung internal comparison claim. Manufacturer-reported performance; workload, precision and test conditions affect comparisons.
Graphics
GPU	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GPU architecture	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Ray tracing	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
AI & security
NPU advertised performance	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Manufacturer-reported performance; workload, precision and test conditions affect comparisons.
AI performance claim	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Samsung internal comparison claim. Manufacturer-reported performance; workload, precision and test conditions affect comparisons.
AI framework	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
NPU configuration	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Memory & interfaces
Memory	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Storage	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera, video & display
Maximum camera resolution	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Display	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera processing modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die The structured specifications give 8K30 encoding and 8K60 decoding; the marketing paragraph reverses recording/playback rates. The table values are shown here with that source conflict retained.
Video codecs	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Codec list; not every codec is established at every listed encode/decode mode.
Connectivity & devices
Modem standard	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem peak downlink	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
NTN	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GNSS	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Wireless interface	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Connectivity	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem rates	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Theoretical link maxima under supported radio conditions; not an observed network speed.
Packaging, power & physical analysis
Packaging	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Verified die geometry	UnconfirmedSamsung Scope: silicon-die Source date: 2025-07-09 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.
Additional specifications
Modulation	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die