SAMSUNG / SILICON DESIGN

Samsung Exynos 2400

The Exynos 2400 is Samsung’s ten-core 2024 flagship mobile SoC, using a third-generation 4 nm low-power node, RDNA 3-based Xclipse 940 graphics, FOWLP packaging and Release 17 5G/NTN support.

Samsung Exynos 2400 DIE PHOTOGRAPH

Image courtesy of Chipwise ·Used with permission

1200 × 986 PX SOURCE / 100%

드래그로 이동

Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.

Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

Exynos 2400 die shot. See source caption; no chip layer inferred beyond source evidence

Source photography; preparation and visible markings are preserved. This photograph supplies no independently verified geometric measurements.

원본과 고해상도

사양

36 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceSamsung Scope: silicon-die Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Foundry	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Independent analyst attribution.
Preview date	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die
CPU & clock domains
CPU cores	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU topology	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
CPU configuration	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Samsung’s current table lists peak clocks with five A720 cores grouped together; device frequency tables may distinguish additional clock groups.
CPU prime peak	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Graphics
GPU	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GPU architecture	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die
GPU core count	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Ray tracing	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
AI & security
AI performance claim	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Manufacturer-reported performance; workload, precision and test conditions affect comparisons.
NPU configuration	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Memory & interfaces
Memory	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Storage	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera, video & display
Maximum camera resolution	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera sensor concurrency	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Display	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Camera processing modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video modes	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Video codecs	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Codec list; not every codec is established at every listed encode/decode mode.
Connectivity & devices
Modem standard	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem bands	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem peak downlink	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
NTN	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
GNSS	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Documented devices	Manufacturer / primary sourceSamsung Global Newsroom Scope: silicon-die Device use varies by market; Samsung’s S24 FE release calls its chip an Exynos 2400-series chipset.
Connectivity	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die
Modem rates	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die Theoretical link maxima under supported radio conditions; not an observed network speed.
Packaging, power & physical analysis
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-26 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Kurnal’s original die-shot entry reports 10.61 × 12.95 mm and 137.4 mm². Samsung does not publish die area.
Verified die geometry	UnconfirmedSamsung Scope: silicon-die No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.
Packaging	Manufacturer / primary sourceSamsung Semiconductor Scope: silicon-die

출처가 연결된 기록해설·기록 업데이트 2026-09-09

ARCHITECTURE → RTL → GDS

이 기록으로 설계 검토하기

전체 설계 가이드 ↗

확인된 사양에서 출발해 아래 검토 항목을 활용하세요. 검토 항목은 설계 지침이며 이 제품의 비공개 RTL이나 물리 구현을 설명하는 것은 아닙니다.

CPU cores: Samsung Semiconductor ↗
GPU: Samsung Semiconductor ↗
Process: Samsung Semiconductor ↗
Memory: Samsung Semiconductor ↗
Storage: Samsung Semiconductor ↗
NPU configuration: Samsung Semiconductor ↗
Reported die area: Kurnal Insights ↗

워크로드와 트래픽 모델

공개된 CPU·그래픽·AI·I/O 엔진 사이의 트래픽 행렬을 만드세요. 공유 메모리의 중재와 버퍼 크기를 정하기 전에 동시 버스트·데이터 재사용·최악 응답 시간을 모델링하세요.

RTL 전에 정할 계약

대표적인 생산자-소비자 경로를 고르고 수락 조건·순서·백프레셔·미완료 요청 용량·리셋 복구를 명세하세요. 데이터패스를 최적화하기 전에 이 계약을 assertion과 테스트 시나리오로 바꾸세요.

실현 가능한 물리설계

매크로 abstract·핀 배치·타이밍 라이브러리·활동도 기반 전력 추정치를 확보하세요. 매크로 인접성·배선 채널·전원 연결성을 함께 검토해야 합니다. 주석 다이 사진은 검토 질문을 찾는 데 유용하지만 넷리스트·PDK·사인오프 제약을 제공하지는 않습니다.

기록의 물리적 범위를 살펴보세요.

The Exynos 2400 is Samsung’s ten-core 2024 flagship mobile SoC, using a third-generation 4 nm low-power node, RDNA 3-based Xclipse 940 graphics, FOWLP packaging and Release 17 5G/NTN support.

이 기록에는 신원과 출처 근거가 있습니다. 심층 아키텍처 해설은 아직 작성되지 않았습니다. 보이는 패턴만으로 블록 기능·용량·내부 프로토콜을 단정하지 않습니다.

근거가 있는 연결

2 SOURCE-LINKED RELATIONSHIPS

member ofSamsung Exynos mobile processorsproduct family

Product-series membership; does not assert shared masks or identical silicon.

Samsung · 근거

다음 세대Samsung Exynos 2500silicon design

Samsung footnotes identify Exynos 2400 as predecessor.

Samsung · 근거

THE VISUAL EVIDENCE

시각 자료

3 개의 확인된 출처

작성자가 X에 공유한 다이 사진입니다. 원문에서 사진과 토론을 자세히 볼 수 있습니다.

Die photograph · X

Samsung Exynos 2400 (E9945) Dieshot Layout

X 원문 게시물을 불러오는 중…

Samsung Exynos 2400 (E9945) Dieshot LayoutKurnal @Kurnalsalts · 2024-04-30X 원문 게시물 보기

게시 이미지 출처 · 2

Die photographMuseum 게시

Samsung Exynos 2400 — Die photograph

Chipwise / NanoPhysics

1,200 × 985 px기술 아카이브 · 분석

Exynos 2400 die shot. Frontside die view, as identified by source

원본 다이 사진 보기

권리 · 출처 · 링크 이력

Rights status: PERMISSION GRANTED
Licence: Used with permission — attribution required ↗
Local hosting / thumbnails / hotlinking: Allowed / Allowed / Not enabled
Attribution: Image courtesy of Chipwise · Used with permission
Identity / confidence: matched / high
Evidence reviewed: 2026-09-09
Link checked: 2026-09-09 · ok · HTTP 200

사용 조건 근거 ↗

원문 열람 가능 여부와 이미지 재사용 권한은 별개입니다.

Die photographMuseum 게시

Samsung Exynos 2400 — Die photograph

Chipwise / NanoPhysics

1,200 × 986 px기술 아카이브 · 분석

Exynos 2400 die shot. See source caption; no chip layer inferred beyond source evidence

원본 다이 사진 보기

권리 · 출처 · 링크 이력

Rights status: PERMISSION GRANTED
Licence: Used with permission — attribution required ↗
Local hosting / thumbnails / hotlinking: Allowed / Allowed / Not enabled
Attribution: Image courtesy of Chipwise · Used with permission
Identity / confidence: matched / high
Evidence reviewed: 2026-09-09
Link checked: 2026-09-09 · ok · HTTP 200

사용 조건 근거 ↗

원문 열람 가능 여부와 이미지 재사용 권한은 별개입니다.

원 출처까지

Exynos 2400 ↗ · Samsung

Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 ↗ · Samsung

Kurnal die catalog: Samsung Exynos 2400 ↗ · Kurnal Insights

Exynos 2400 | Mobile Processor ↗ · Samsung Semiconductor

Exynos 2400 embedded Specifications ↗ · Samsung Semiconductor

Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 ↗ · Samsung Global Newsroom

Galaxy S24 Series Expands With S24 FE ↗ · Samsung Global Newsroom

Exynos 2400 (S5E9945) ↗ · Kurnal Insights

Exynos 2400 — official structured specifications ↗ · Samsung Semiconductor

Exynos 2400 die shot — Chipwise image source ↗ · Chipwise / NanoPhysics