SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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20,053 recordsSort

cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
AMD Zen 2 CCDAMD · silicon die · 2019	2 CCXsCCXs per CCDphysical core-complex die	unresearched	16 MBMaximum L3 per CCXphysical core-complex die	unresearched	74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure
Intel 4004Intel · silicon die · 1971	unresearched	unresearched	unresearched	10 µmProcess labelprocessor design	unresearched
Intel 8086Intel · silicon die · 1978	unresearched	unresearched	unresearched	3 µmProcess labelprocessor design	unresearched
MOS Technology 6502MOS Technology · silicon die · 1975	unresearched	unresearched	unresearched	unresearched	unresearched
Intel386 DXIntel · product family · 1985	unresearched	unresearched	unresearched	unresearched	unresearched
Intel Pentium 60/66 MHzIntel · silicon die · 1993	unresearched	unresearched	unresearched	0.8 µmProcess labeloriginal 60/66 MHz models	unresearched
AMD Ryzen 5 3600AMD · product model · 2019	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched
AMD Ryzen 5 5600XAMD · product model · 2020	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched

gpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA GeForce 256NVIDIA · silicon die · 1999	unresearched	unresearched	unresearched	unresearched	unresearched
	NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022	unresearched	unresearched	unresearched	unresearched	814 mm²Die areaOne full GH100 silicon die powering H100

specimen

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Subject	Package	Die area
	AMD Zen 3 CCD specimenAMD · physical specimen	unresearched	unresearched	unresearched

accelerator

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA A100NVIDIA · silicon die · 2020	unresearched	unresearched	unresearched	unresearched	826 mm²Die areaOne GA100 silicon die powering A100

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Specification / evidence	Samsung Exynos 2400silicon-die	Samsung Exynos 2500silicon-die
Year	official-disclosure · sourcedScope: silicon-dieYear identifies first public introduction where a dated launch is available; see record notes for exceptions.Source ↗	official-disclosure · sourcedScope: silicon-dieSource date: 2025-07-092025 confirmed by the dated Galaxy Z Flip7 announcement and AP specification. This is not claimed to be the first public chip announcement date.Source ↗
Process	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU cores	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
GPU	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Reported die width	third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.Source ↗	Unresearched for this record
Reported die height	third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.Source ↗	Unresearched for this record
Reported die area	third-party-report · sourcedScope: silicon-dieKurnal’s original die-shot entry reports 10.61 × 12.95 mm and 137.4 mm². Samsung does not publish die area.Source ↗	Unresearched for this record
Foundry	third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Independent analyst attribution.Source ↗	unknown · unresearchedScope: silicon-dieSource date: 2025-07-09No foundry attribution accepted from inspected sources.Source ↗
Verified die geometry	unknown · unresearchedScope: silicon-dieNo source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.Source ↗	unknown · unresearchedScope: silicon-dieSource date: 2025-07-09No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.Source ↗
Preview date	official-disclosure · sourcedScope: silicon-dieSource ↗	Unresearched for this record
CPU topology	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU configuration	official-disclosure · sourcedScope: silicon-dieSamsung’s current table lists peak clocks with five A720 cores grouped together; device frequency tables may distinguish additional clock groups.Source ↗	Unresearched for this record
CPU prime peak	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
GPU architecture	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
GPU core count	official-disclosure · sourcedScope: silicon-dieSource ↗	Unresearched for this record
Ray tracing	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
AI performance claim	official-disclosure · sourcedScope: silicon-dieManufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗	official-disclosure · sourcedScope: silicon-dieSamsung internal comparison claim. Manufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗
Packaging	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Maximum camera resolution	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Camera sensor concurrency	official-disclosure · sourcedScope: silicon-dieSource ↗	Unresearched for this record
Video	official-disclosure · sourcedScope: silicon-dieSource ↗	Unresearched for this record
Modem standard	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Modem bands	official-disclosure · sourcedScope: silicon-dieSource ↗	Unresearched for this record
Modem peak downlink	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
NTN	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
GNSS	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Documented devices	official-disclosure · sourcedScope: silicon-dieDevice use varies by market; Samsung’s S24 FE release calls its chip an Exynos 2400-series chipset.Source ↗	Unresearched for this record
NPU configuration	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Memory	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Storage	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Display	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Camera processing modes	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Video modes	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · conflictingScope: silicon-dieThe structured specifications give 8K30 encoding and 8K60 decoding; the marketing paragraph reverses recording/playback rates. The table values are shown here with that source conflict retained.Source ↗
Video codecs	official-disclosure · sourcedScope: silicon-dieCodec list; not every codec is established at every listed encode/decode mode.Source ↗	official-disclosure · sourcedScope: silicon-dieCodec list; not every codec is established at every listed encode/decode mode.Source ↗
Connectivity	official-disclosure · sourcedScope: silicon-dieSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Modem rates	official-disclosure · sourcedScope: silicon-dieTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗	official-disclosure · sourcedScope: silicon-dieTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗
CPU prime core	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU middle cores	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU efficiency cores	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Cpu performance claim	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSamsung internal comparison claim. Manufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗
NPU advertised performance	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieManufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗
AI framework	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Modulation	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Wireless interface	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Product status	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗

Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.