SEMICONDUCTOR REFERENCE
Explore the collection
Find products, devices, processes and manufacturing tools with specifications and original sources.
Specification query syntax
Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.
Results
cpu
| Compare | Entity | CPU organization | Clock / peak | Cache | Process label | Die area |
|---|---|---|---|---|---|---|
AMD Zen 2 CCDAMD · silicon die · 2019 | 2 CCXsCCXs per CCDphysical core-complex die | unresearched | 16 MBMaximum L3 per CCXphysical core-complex die | unresearched | 74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure | |
Intel 4004Intel · silicon die · 1971 | unresearched | unresearched | unresearched | 10 µmProcess labelprocessor design | unresearched | |
Intel 8086Intel · silicon die · 1978 | unresearched | unresearched | unresearched | 3 µmProcess labelprocessor design | unresearched | |
MOS Technology 6502MOS Technology · silicon die · 1975 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel386 DXIntel · product family · 1985 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel Pentium 60/66 MHzIntel · silicon die · 1993 | unresearched | unresearched | unresearched | 0.8 µmProcess labeloriginal 60/66 MHz models | unresearched | |
AMD Ryzen 5 3600AMD · product model · 2019 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched | |
AMD Ryzen 5 5600XAMD · product model · 2020 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched |
gpu
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA GeForce 256NVIDIA · silicon die · 1999 | unresearched | unresearched | unresearched | unresearched | unresearched | |
NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022 | unresearched | unresearched | unresearched | unresearched | 814 mm²Die areaOne full GH100 silicon die powering H100 |
specimen
| Compare | Entity | Subject | Package | Die area |
|---|---|---|---|---|
AMD Zen 3 CCD specimenAMD · physical specimen | unresearched | unresearched | unresearched |
accelerator
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA A100NVIDIA · silicon die · 2020 | unresearched | unresearched | unresearched | unresearched | 826 mm²Die areaOne GA100 silicon die powering A100 |
Compare specifications
Source values, conditions and entity scope stay together.
| Specification / evidence | Samsung Exynos 2200silicon-die | Samsung Exynos 9820silicon-die |
|---|---|---|
| Record year | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Year basis: announced. This is distinct from source publication and record update.Source ↗ | Unresearched for this record |
| Process label | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ | Unresearched for this record |
| CPU cores | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU composition | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ | Unresearched for this record |
| GPU architecture | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Announcement date | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Process | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU ISA | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU topology | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU prime core | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU performance cores | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU efficiency cores | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| GPU | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Ray tracing | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Variable rate shading | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| NPU configuration | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| NPU precision | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Maximum camera resolution | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Camera modes | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video capabilities | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Modem | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem peak | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Security | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Reported die area | third-party-report · sourcedScope: SoC designThird-party die-shot measurement (9.69 × 10.8 mm); not a Samsung-disclosed specification.Source ↗ | Unresearched for this record |
| CPU configuration | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Memory | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Storage | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Display | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Camera processing modes | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video modes | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video codecs | official-disclosure · sourcedScope: SoC designCodec list; not every codec is established at every listed encode/decode mode.Source ↗ | Unresearched for this record |
| Connectivity | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Modem rates | official-disclosure · sourcedScope: SoC designTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗ | Unresearched for this record |
| CPU custom | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| AI | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Camera | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Video | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.





