VLSI KoreaSEMICONDUCTOR REFERENCE
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Find products, devices, processes and manufacturing tools with specifications and original sources.
Specification query syntax
Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.
Results
cpu
| Compare | Entity | CPU organization | Clock / peak | Cache | Process label | Die area |
|---|---|---|---|---|---|---|
AMD Zen 2 CCDAMD · silicon die · 2019 | 2 CCXsCCXs per CCDphysical core-complex die | unresearched | 16 MBMaximum L3 per CCXphysical core-complex die | unresearched | 74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure | |
Intel 4004Intel · silicon die · 1971 | unresearched | unresearched | unresearched | 10 µmProcess labelprocessor design | unresearched | |
Intel 8086Intel · silicon die · 1978 | unresearched | unresearched | unresearched | 3 µmProcess labelprocessor design | unresearched | |
MOS Technology 6502MOS Technology · silicon die · 1975 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel386 DXIntel · product family · 1985 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel Pentium 60/66 MHzIntel · silicon die · 1993 | unresearched | unresearched | unresearched | 0.8 µmProcess labeloriginal 60/66 MHz models | unresearched | |
AMD Ryzen 5 3600AMD · product model · 2019 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched | |
AMD Ryzen 5 5600XAMD · product model · 2020 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched |
gpu
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA GeForce 256NVIDIA · silicon die · 1999 | unresearched | unresearched | unresearched | unresearched | unresearched | |
NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022 | unresearched | unresearched | unresearched | unresearched | 814 mm²Die areaOne full GH100 silicon die powering H100 |
specimen
| Compare | Entity | Subject | Package | Die area |
|---|---|---|---|---|
AMD Zen 3 CCD specimenAMD · physical specimen | unresearched | unresearched | unresearched |
accelerator
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA A100NVIDIA · silicon die · 2020 | unresearched | unresearched | unresearched | unresearched | 826 mm²Die areaOne GA100 silicon die powering A100 |
Compare specifications
Source values, conditions and entity scope stay together.
| Specification / evidence | Samsung Exynos 2200silicon-die | Samsung Exynos 2400silicon-die |
|---|---|---|
| Record year | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Year basis: announced. This is distinct from source publication and record update.Source ↗ | Unresearched for this record |
| Process label | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ | Unresearched for this record |
| CPU cores | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU composition | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ | Unresearched for this record |
| GPU architecture | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Announcement date | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Process | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU ISA | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU topology | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU prime core | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU performance cores | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU efficiency cores | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| GPU | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Ray tracing | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Variable rate shading | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| NPU configuration | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| NPU precision | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Maximum camera resolution | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Camera modes | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video capabilities | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Modem | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Modem peak | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Security | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Reported die area | third-party-report · sourcedScope: SoC designThird-party die-shot measurement (9.69 × 10.8 mm); not a Samsung-disclosed specification.Source ↗ | third-party-report · sourcedScope: silicon-dieKurnal’s original die-shot entry reports 10.61 × 12.95 mm and 137.4 mm². Samsung does not publish die area.Source ↗ |
| CPU configuration | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSamsung’s current table lists peak clocks with five A720 cores grouped together; device frequency tables may distinguish additional clock groups.Source ↗ |
| Memory | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Storage | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Display | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Camera processing modes | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Video modes | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Video codecs | official-disclosure · sourcedScope: SoC designCodec list; not every codec is established at every listed encode/decode mode.Source ↗ | official-disclosure · sourcedScope: silicon-dieCodec list; not every codec is established at every listed encode/decode mode.Source ↗ |
| Connectivity | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem rates | official-disclosure · sourcedScope: SoC designTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗ | official-disclosure · sourcedScope: silicon-dieTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗ |
| Year | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieYear identifies first public introduction where a dated launch is available; see record notes for exceptions.Source ↗ |
| Reported die width | Unresearched for this record | third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.Source ↗ |
| Reported die height | Unresearched for this record | third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.Source ↗ |
| Foundry | Unresearched for this record | third-party-report · sourcedScope: silicon-dieSource date: 2026-02-26Independent analyst attribution.Source ↗ |
| Verified die geometry | Unresearched for this record | unknown · unresearchedScope: silicon-dieNo source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.Source ↗ |
| Preview date | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU prime peak | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| GPU core count | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| AI performance claim | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieManufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗ |
| Packaging | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Camera sensor concurrency | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Video | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem standard | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem bands | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem peak downlink | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| NTN | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| GNSS | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Documented devices | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieDevice use varies by market; Samsung’s S24 FE release calls its chip an Exynos 2400-series chipset.Source ↗ |
Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.