SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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20,053 recordsSort

cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
AMD Zen 2 CCDAMD · silicon die · 2019	2 CCXsCCXs per CCDphysical core-complex die	unresearched	16 MBMaximum L3 per CCXphysical core-complex die	unresearched	74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure
Intel 4004Intel · silicon die · 1971	unresearched	unresearched	unresearched	10 µmProcess labelprocessor design	unresearched
Intel 8086Intel · silicon die · 1978	unresearched	unresearched	unresearched	3 µmProcess labelprocessor design	unresearched
MOS Technology 6502MOS Technology · silicon die · 1975	unresearched	unresearched	unresearched	unresearched	unresearched
Intel386 DXIntel · product family · 1985	unresearched	unresearched	unresearched	unresearched	unresearched
Intel Pentium 60/66 MHzIntel · silicon die · 1993	unresearched	unresearched	unresearched	0.8 µmProcess labeloriginal 60/66 MHz models	unresearched
AMD Ryzen 5 3600AMD · product model · 2019	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched
AMD Ryzen 5 5600XAMD · product model · 2020	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched

gpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA GeForce 256NVIDIA · silicon die · 1999	unresearched	unresearched	unresearched	unresearched	unresearched
	NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022	unresearched	unresearched	unresearched	unresearched	814 mm²Die areaOne full GH100 silicon die powering H100

specimen

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Subject	Package	Die area
	AMD Zen 3 CCD specimenAMD · physical specimen	unresearched	unresearched	unresearched

accelerator

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA A100NVIDIA · silicon die · 2020	unresearched	unresearched	unresearched	unresearched	826 mm²Die areaOne GA100 silicon die powering A100

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Specification / evidence	Samsung Exynos 2100silicon-die	Samsung Exynos 9820silicon-die
Record year	official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Year basis: announced. This is distinct from source publication and record update.Source ↗	Unresearched for this record
Process label	official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗	Unresearched for this record
CPU cores	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
CPU composition	official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗	Unresearched for this record
Cortex-X1 clock	official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗	Unresearched for this record
Announcement date	official-disclosure · sourcedScope: SoC designSamsung announced it through Exynos On 2021.Source ↗	Unresearched for this record
Process	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU topology	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
CPU prime core	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
CPU prime peak	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
CPU performance cores	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
CPU efficiency cores	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
GPU	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Graphics apis	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
NPU architecture	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
NPU advertised performance	official-disclosure · sourcedScope: SoC designManufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗	Unresearched for this record
Memory	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Memory bandwidth	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Storage	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Maximum camera resolution	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Camera sensor concurrency	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Video encoding	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Video decoding	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Modem	official-disclosure · sourcedScope: SoC designSource ↗	official-disclosure · sourcedScope: silicon-dieSource ↗
Modem peak downlink	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Production status	official-disclosure · sourcedScope: SoC designSource ↗	Unresearched for this record
Reported die area	third-party-report · sourcedScope: SoC designKurnal’s original die-shot entry reports 10.93 × 11.72 mm and 128.1 mm². Samsung does not publish die area.Source ↗	Unresearched for this record
CPU custom	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
AI	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Camera	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗
Video	Unresearched for this record	official-disclosure · sourcedScope: silicon-dieSource ↗

Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.