SEMICONDUCTOR REFERENCE

Explore the collection

Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

Results

20,053 records

cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
CompareEntityCPU organizationClock / peakCacheProcess labelDie area
AMD Zen 2 CCDAMD · silicon die · 2019
2 CCXsCCXs per CCDphysical core-complex dieunresearched16 MBMaximum L3 per CCXphysical core-complex dieunresearched74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure
Intel 4004Intel · silicon die · 1971
unresearchedunresearchedunresearched10 µmProcess labelprocessor designunresearched
Intel 8086Intel · silicon die · 1978
unresearchedunresearchedunresearched3 µmProcess labelprocessor designunresearched
MOS Technology 6502MOS Technology · silicon die · 1975
unresearchedunresearchedunresearchedunresearchedunresearched
Intel386 DXIntel · product family · 1985
unresearchedunresearchedunresearchedunresearchedunresearched
Intel Pentium 60/66 MHzIntel · silicon die · 1993
unresearchedunresearchedunresearched0.8 µmProcess labeloriginal 60/66 MHz modelsunresearched
AMD Ryzen 5 3600AMD · product model · 2019
unresearchedunresearched32 MBL3 cachecomplete processor productunresearchedunresearched
AMD Ryzen 5 5600XAMD · product model · 2020
unresearchedunresearched32 MBL3 cachecomplete processor productunresearchedunresearched

gpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
CompareEntityCompute organizationLocal memoryExternal memoryMemory bandwidthDie area
NVIDIA GeForce 256NVIDIA · silicon die · 1999
unresearchedunresearchedunresearchedunresearchedunresearched
NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022
unresearchedunresearchedunresearchedunresearched814 mm²Die areaOne full GH100 silicon die powering H100

specimen

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
CompareEntitySubjectPackageDie area
AMD Zen 3 CCD specimenAMD · physical specimen
unresearchedunresearchedunresearched

accelerator

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
CompareEntityCompute organizationLocal memoryExternal memoryMemory bandwidthDie area
NVIDIA A100NVIDIA · silicon die · 2020
unresearchedunresearchedunresearchedunresearched826 mm²Die areaOne GA100 silicon die powering A100

Compare specifications

Source values, conditions and entity scope stay together.

Specification / evidenceSamsung Exynos 1480silicon-dieSamsung Exynos 2200silicon-die
Process
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
GPU
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
CPU configuration
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
NPU configuration
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Memory
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Storage
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Display
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Camera processing modes
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Video modes
official-disclosure · sourcedScope: silicon-dieSource ↗
official-disclosure · sourcedScope: SoC designSource ↗
Video codecs
official-disclosure · sourcedScope: silicon-dieCodec list; not every codec is established at every listed encode/decode mode.Source ↗
official-disclosure · sourcedScope: SoC designCodec list; not every codec is established at every listed encode/decode mode.Source ↗
Connectivity
official-disclosure · sourcedScope: silicon-dieManufacturer connectivity/interface support; integration scope depends on the complete platform.Source ↗
official-disclosure · sourcedScope: SoC designSource ↗
Modem rates
official-disclosure · sourcedScope: silicon-dieTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗
official-disclosure · sourcedScope: SoC designTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗
Record yearUnresearched for this record
official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Year basis: announced. This is distinct from source publication and record update.Source ↗
Process labelUnresearched for this record
official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗
CPU coresUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU compositionUnresearched for this record
official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗
GPU architectureUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Announcement dateUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU ISAUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU topologyUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU prime coreUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU performance coresUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
CPU efficiency coresUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Ray tracingUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Variable rate shadingUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
NPU precisionUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Maximum camera resolutionUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Camera modesUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Video capabilitiesUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
ModemUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Modem peakUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
SecurityUnresearched for this record
official-disclosure · sourcedScope: SoC designSource ↗
Reported die areaUnresearched for this record
third-party-report · sourcedScope: SoC designThird-party die-shot measurement (9.69 × 10.8 mm); not a Samsung-disclosed specification.Source ↗

Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.