SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
AMD Zen 2 CCDAMD · silicon die · 2019	2 CCXsCCXs per CCDphysical core-complex die	unresearched	16 MBMaximum L3 per CCXphysical core-complex die	unresearched	74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure
Intel 4004Intel · silicon die · 1971	unresearched	unresearched	unresearched	10 µmProcess labelprocessor design	unresearched
Intel 8086Intel · silicon die · 1978	unresearched	unresearched	unresearched	3 µmProcess labelprocessor design	unresearched
MOS Technology 6502MOS Technology · silicon die · 1975	unresearched	unresearched	unresearched	unresearched	unresearched
Intel386 DXIntel · product family · 1985	unresearched	unresearched	unresearched	unresearched	unresearched
Intel Pentium 60/66 MHzIntel · silicon die · 1993	unresearched	unresearched	unresearched	0.8 µmProcess labeloriginal 60/66 MHz models	unresearched
AMD Ryzen 5 3600AMD · product model · 2019	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched
AMD Ryzen 5 5600XAMD · product model · 2020	unresearched	unresearched	32 MBL3 cachecomplete processor product	unresearched	unresearched

gpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA GeForce 256NVIDIA · silicon die · 1999	unresearched	unresearched	unresearched	unresearched	unresearched
	NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022	unresearched	unresearched	unresearched	unresearched	814 mm²Die areaOne full GH100 silicon die powering H100

specimen

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Subject	Package	Die area
	AMD Zen 3 CCD specimenAMD · physical specimen	unresearched	unresearched	unresearched

accelerator

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	Compute organization	Local memory	External memory	Memory bandwidth	Die area
	NVIDIA A100NVIDIA · silicon die · 2020	unresearched	unresearched	unresearched	unresearched	826 mm²Die areaOne GA100 silicon die powering A100

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Specification / evidence	Apple M1silicon-die	Apple M2silicon-die	Apple M3silicon-die	Apple M4silicon-die
Record year	official-disclosure · sourcedScope: SoC designSource date: 2020-11-10Year basis: announced. This is distinct from source publication and record update.Source ↗	official-disclosure · sourcedScope: SoC designSource date: 2022-06-06Year basis: announced. This is distinct from source publication and record update.Source ↗	official-disclosure · sourcedScope: base M3 SoC designSource date: 2023-10-30Year basis: announced. This is distinct from source publication and record update.Source ↗	official-disclosure · sourcedScope: SoC design; configurations varySource date: 2024-05-07Year basis: announced. This is distinct from source publication and record update.Source ↗
Transistors	official-disclosure · sourcedScope: SoC designSource date: 2020-11-10Source ↗	official-disclosure · sourcedScope: SoC designSource date: 2022-06-06Source ↗	official-disclosure · sourcedScope: base M3 SoC designSource date: 2023-10-30Source ↗	official-disclosure · sourcedScope: SoC design; configurations varySource date: 2024-05-07Source ↗
Process label	official-disclosure · sourcedScope: SoC designSource date: 2020-11-10Source ↗	official-disclosure · sourcedScope: SoC designSource date: 2022-06-06Source ↗	official-disclosure · sourcedScope: base M3 SoC designSource date: 2023-10-30Source ↗	official-disclosure · sourcedScope: SoC design; configurations varySource date: 2024-05-07Source ↗
CPU cores	official-disclosure · sourcedScope: SoC designSource date: 2020-11-10Source ↗	Unresearched for this record	official-disclosure · sourcedScope: base M3 SoC designSource date: 2023-10-30Source ↗	Unresearched for this record
CPU composition	official-disclosure · sourcedScope: SoC designSource date: 2020-11-10Source ↗	Unresearched for this record	Unresearched for this record	Unresearched for this record
Die area	independent-measurement · sourcedScope: Base M1 physical die measured by original author; part obtained in 2020Original analyst self-reported physical measurement. Instrument, boundary convention and uncertainty are not published. Stated area is retained; product of rounded dimensions is 122.7088 mm². Post also discusses preliminary M1 Pro/Max estimates; do not transfer those estimates.Source ↗	Unresearched for this record	Unresearched for this record	Unresearched for this record
Die width	independent-measurement · sourcedScope: Base M1 physical die measured by original author; part obtained in 2020Ordered x/y dimensions as stated by author; reference image orientation and die-edge boundary convention are not specified.Source ↗	Unresearched for this record	Unresearched for this record	Unresearched for this record
Die height	independent-measurement · sourcedScope: Base M1 physical die measured by original author; part obtained in 2020Ordered x/y dimensions as stated by author; reference image orientation and die-edge boundary convention are not specified.Source ↗	Unresearched for this record	Unresearched for this record	Unresearched for this record
Unified memory bandwidth	Unresearched for this record	official-disclosure · sourcedScope: SoC designSource date: 2022-06-06Source ↗	Unresearched for this record	Unresearched for this record
Maximum unified memory	Unresearched for this record	official-disclosure · sourcedScope: SoC designSource date: 2022-06-06Source ↗	official-disclosure · sourcedScope: base M3 SoC designSource date: 2023-10-30Source ↗	Unresearched for this record
Maximum CPU cores	Unresearched for this record	Unresearched for this record	Unresearched for this record	official-disclosure · sourcedScope: SoC design; configurations varySource date: 2024-05-07Source ↗

Measured benchmarks must include workload/version, configuration, power mode and date. Theoretical peaks and vendor claims are not measured benchmark results.