Apple M2 — annotated die shot

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Apple M2 — annotated die shotReptalica @Reptalicant · View original post on X
SILICON DESIGN / 2022

Apple M2

The second generation of Apple’s M-series silicon expanded unified memory capacity and bandwidth.

Research connections

Identity & fabrication
Record year
Manufacturer / primary sourceApple

Scope: SoC design

Source date: 2022-06-06

Year basis: announced. This is distinct from source publication and record update.

Process label
Manufacturer / primary sourceApple

Scope: SoC design

Source date: 2022-06-06

Packaging, power & physical analysis
Transistors
Manufacturer / primary sourceApple

Scope: SoC design

Source date: 2022-06-06

Additional specifications
Unified memory bandwidth
Manufacturer / primary sourceApple

Scope: SoC design

Source date: 2022-06-06

Maximum unified memory
Manufacturer / primary sourceApple

Scope: SoC design

Source date: 2022-06-06

Die photographs shared by their authors on X. Open a post to explore its images and discussion.

Reptalica · @Reptalicant · View the post above ↑
Referenced by · product generationApple M1silicon design

M-series generation succession; this is not a claim of shared silicon.

Apple · Evidence
product generationApple M3silicon design

M-series generation succession; this is not a claim of shared silicon.

Apple · Evidence

Under the surface.

Apple disclosed a 100 GB/s unified-memory interface and support for up to 24 GB of unified memory in M2. These are interface and capacity specifications, not independently measured application bandwidth.

CURATOR INTERPRETATIONMore available memory and more interface bandwidth address different bottlenecks. A workload can be limited by capacity, transfers, computation or software; a single specification does not identify which one.