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SOURCE-LINKED COMPARISON

Samsung Exynos 2200 vs Samsung Exynos 2400

CPU cores: Samsung Exynos 2200 8; Samsung Exynos 2400 10. A sourced specification comparison.

Samsung Exynos 2200 and Samsung Exynos 2400 are compared as silicon designs in the same soc cohort. CPU cores: Samsung Exynos 2200 lists 8; Samsung Exynos 2400 lists 10. CPU description: Samsung Exynos 2200 lists 1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510; Samsung Exynos 2400 lists 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz. The listed organization describes the documented configuration; it does not rank application speed.

Memory technology: Samsung Exynos 2200 lists LPDDR5; Samsung Exynos 2400 lists LPDDR5X. Storage interface: Samsung Exynos 2200 lists UFS 3.1; Samsung Exynos 2400 lists UFS 4.0. NPU configuration: Samsung Exynos 2200 lists AI engine with dual-core NPU and DSP; Samsung Exynos 2400 lists AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSP. Process label: Samsung Exynos 2200 lists 4nm EUV; Samsung Exynos 2400 lists 4 nm FinFET. Reported die area: Samsung Exynos 2200 lists 104.65 mm²; Samsung Exynos 2400 lists 137.4 mm². The GPU and memory descriptions help identify the documented graphics and data interfaces. Reported geometry remains an estimate with its original qualification.

This comparison matches 18 sourced fields across 8 specification sections. 14 fields differ. 34 of 36 field values use manufacturer disclosures; remaining values retain their source evidence class. 34 field values have no publication date in the catalog. There is no matched measured workload benchmark or current price evidence in this page, so it cannot establish a purchase winner, energy-efficiency winner or total system cost.

Documented differences

Specification / evidenceSamsung Exynos 2200silicon-die · socSamsung Exynos 2400silicon-die · soc
NPU configurationRead the original field scope, conditions and source before comparing.AI engine with dual-core NPU and DSPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · AI rowAI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · AI row
Camera processing modesRead the original field scope, conditions and source before comparing.Single camera 200MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+36MP @30 fpsScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Camera (Rear) rowSingle camera 320MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+32MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Camera (Rear) row
DisplayRead the original field scope, conditions and source before comparing.4K/WQUXGA @120 Hz, QHD+ @144 HzScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Display row4K/WQUXGA @120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Display row
Maximum camera resolutionRead the original field scope, conditions and source before comparing.200 MPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 99320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 247-248, 279-281
Video codecsRead the original field scope, conditions and source before comparing.HEVC (H.265), VP9, AV1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Video Codec rowHEVC (H.265), VP9, AV1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video Codec row
Video modesRead the original field scope, conditions and source before comparing.8K 30 fps encoding, 8K 60 fps decodingScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Video (Playback) row8K 30 fps encoding, 8K 60 fps decodingScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video (Playback) row
ConnectivityRead the original field scope, conditions and source before comparing.GNSSScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Connectivity rowGNSSScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Connectivity row
Modem ratesRead the original field scope, conditions and source before comparing.5G NR Sub-6GHz 5.1 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 7.35 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Modem row5G NR Sub-6GHz 9.64 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 12.1 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Modem row
CPU coresOrganization and listed limits do not establish workload performance.8Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 9110Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-272
CPU descriptionOrganization and listed limits do not establish workload performance.1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510Scope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · CPU paragraph — tri-cluster structure1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, CPU: ‘Cortex-X4 3.2 GHz, Cortex-A720x5 2.9 GHz, Cortex-A520x4 1.95 GHz’
CPU topologyOrganization and listed limits do not establish workload performance.1+3+4 tri-clusterScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 91tri-cluster deca-coreScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-272
GPU architectureOrganization and listed limits do not establish workload performance.AMD RDNA 2Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · lines 74, 82AMD RDNA 3Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400preview · first-glimpse section
GPU descriptionOrganization and listed limits do not establish workload performance.Xclipse 920Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200pdf · p.3, GPU rowXclipse 940Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 258
Ray tracingRead the original field scope, conditions and source before comparing.hardware-acceleratedScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · lines 82-84hardware-acceleratedScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 219-221, 256-258
Process labelFoundry process names are labels, not equivalent physical dimensions.4nm EUVScope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · Opening statement4 nm FinFETScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, Process: ‘4nm FinFET’
Memory technologyRead the original field scope, conditions and source before comparing.LPDDR5Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Memory rowLPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Memory row
Storage interfaceRead the original field scope, conditions and source before comparing.UFS 3.1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Storage rowUFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Storage row
Reported die areaSource-reported geometry; calibration and uncertainty may be unavailable.104.65 mm²Scope: SoC designEvidence: third-party-reportSource date: Not suppliedSource: specs-die2200 · Dimensions/Area panel137.4 mm²Scope: silicon-dieEvidence: third-party-reportSource date: Not suppliedSource: specs-die2400 · Die-shot Gallery, Dimensions/Area panel

Who should consider each?

Use this page to study the Samsung Exynos 2200 and Samsung Exynos 2400 designs. A device buyer should compare the specific phone, computer or accelerator SKU, cooling configuration, supported software and measured workload. A full-die specification does not describe every enabled commercial configuration.

Related records

Sources

  1. Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung · 2022-01-18
  2. Exynos 2200 (S5E9925) · Kurnal Insights · Date not supplied
  3. Exynos 2400 (S5E9945) · Kurnal Insights · Date not supplied
  4. Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung Global Newsroom · Date not supplied
  5. Exynos 2200 Product Brief · Samsung Electronics · Date not supplied
  6. Exynos 2400 | Mobile Processor · Samsung Semiconductor · Date not supplied
  7. Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 · Samsung Global Newsroom · Date not supplied
  8. Exynos 2400 embedded Specifications · Samsung Semiconductor · Date not supplied
  9. Exynos 2200 — official structured specifications · Samsung Semiconductor · Date not supplied
  10. Exynos 2400 — official structured specifications · Samsung Semiconductor · Date not supplied

A specification difference is not a measured workload result. Sources and entity scope must match before drawing performance conclusions.