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SOURCE-LINKED COMPARISON

Samsung Exynos 2200 vs Samsung Exynos 2400

CPU cores의 기록 값은 Samsung Exynos 2200 8, Samsung Exynos 2400 10입니다. 출처를 확인할 수 있는 사양 비교입니다.

Samsung Exynos 2200 및 Samsung Exynos 2400의 비교 범위는 같은 soc 계열의 실리콘 설계입니다. CPU cores의 출처 값은 Samsung Exynos 2200 8, Samsung Exynos 2400 10입니다. CPU description의 출처 값은 Samsung Exynos 2200 1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510, Samsung Exynos 2400 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz입니다. 이 구성 값은 문서에 기록된 설계를 설명하며 실제 작업 속도의 순위를 뜻하지 않습니다.

Memory technology의 출처 값은 Samsung Exynos 2200 LPDDR5, Samsung Exynos 2400 LPDDR5X입니다. Storage interface의 출처 값은 Samsung Exynos 2200 UFS 3.1, Samsung Exynos 2400 UFS 4.0입니다. NPU configuration의 출처 값은 Samsung Exynos 2200 AI engine with dual-core NPU and DSP, Samsung Exynos 2400 AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSP입니다. Process label의 출처 값은 Samsung Exynos 2200 4nm EUV, Samsung Exynos 2400 4 nm FinFET입니다. Reported die area의 출처 값은 Samsung Exynos 2200 104.65 mm², Samsung Exynos 2400 137.4 mm²입니다. GPU와 메모리 설명으로 기록된 그래픽 구성과 데이터 인터페이스를 확인할 수 있습니다. 보고된 다이 면적은 원문의 한계가 붙은 추정값으로 유지합니다.

출처가 확인된 18개 필드를 8개 사양 영역에서 대조했으며, 14개 필드의 값이 다릅니다. 전체 36개 값 중 34개는 제조사 공개 자료이며, 나머지 값의 근거 유형도 그대로 표시합니다. 34개 값은 카탈로그에 출처 발행일이 없습니다. 이 페이지에는 동일 조건의 실측 작업 벤치마크나 현재 가격 근거가 없으므로 구매 우열, 에너지 효율 우열, 전체 시스템 비용을 판정할 수 없습니다.

출처에서 확인한 차이

Specification / evidenceSamsung Exynos 2200silicon-die · socSamsung Exynos 2400silicon-die · soc
NPU configurationRead the original field scope, conditions and source before comparing.AI engine with dual-core NPU and DSPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · AI rowAI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · AI row
Camera processing modesRead the original field scope, conditions and source before comparing.Single camera 200MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+36MP @30 fpsScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Camera (Rear) rowSingle camera 320MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+32MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Camera (Rear) row
DisplayRead the original field scope, conditions and source before comparing.4K/WQUXGA @120 Hz, QHD+ @144 HzScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Display row4K/WQUXGA @120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Display row
Maximum camera resolutionRead the original field scope, conditions and source before comparing.200 MPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 99320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 247-248, 279-281
Video codecsRead the original field scope, conditions and source before comparing.HEVC (H.265), VP9, AV1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Video Codec rowHEVC (H.265), VP9, AV1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video Codec row
Video modesRead the original field scope, conditions and source before comparing.8K 30 fps encoding, 8K 60 fps decodingScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Video (Playback) row8K 30 fps encoding, 8K 60 fps decodingScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video (Playback) row
ConnectivityRead the original field scope, conditions and source before comparing.GNSSScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Connectivity rowGNSSScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Connectivity row
Modem ratesRead the original field scope, conditions and source before comparing.5G NR Sub-6GHz 5.1 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 7.35 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Modem row5G NR Sub-6GHz 9.64 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 12.1 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Modem row
CPU coresOrganization and listed limits do not establish workload performance.8Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 9110Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-272
CPU descriptionOrganization and listed limits do not establish workload performance.1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510Scope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · CPU paragraph — tri-cluster structure1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, CPU: ‘Cortex-X4 3.2 GHz, Cortex-A720x5 2.9 GHz, Cortex-A520x4 1.95 GHz’
CPU topologyOrganization and listed limits do not establish workload performance.1+3+4 tri-clusterScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 91tri-cluster deca-coreScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-272
GPU architectureOrganization and listed limits do not establish workload performance.AMD RDNA 2Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · lines 74, 82AMD RDNA 3Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400preview · first-glimpse section
GPU descriptionOrganization and listed limits do not establish workload performance.Xclipse 920Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200pdf · p.3, GPU rowXclipse 940Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 258
Ray tracingRead the original field scope, conditions and source before comparing.hardware-acceleratedScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · lines 82-84hardware-acceleratedScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 219-221, 256-258
Process labelFoundry process names are labels, not equivalent physical dimensions.4nm EUVScope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · Opening statement4 nm FinFETScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, Process: ‘4nm FinFET’
Memory technologyRead the original field scope, conditions and source before comparing.LPDDR5Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Memory rowLPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Memory row
Storage interfaceRead the original field scope, conditions and source before comparing.UFS 3.1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Storage rowUFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Storage row
Reported die areaSource-reported geometry; calibration and uncertainty may be unavailable.104.65 mm²Scope: SoC designEvidence: third-party-reportSource date: Not suppliedSource: specs-die2200 · Dimensions/Area panel137.4 mm²Scope: silicon-dieEvidence: third-party-reportSource date: Not suppliedSource: specs-die2400 · Die-shot Gallery, Dimensions/Area panel

어떤 선택을 검토해야 하나

Samsung Exynos 2200와 Samsung Exynos 2400 설계를 공부할 때 이 비교를 활용할 수 있습니다. 기기를 구매하려면 해당 스마트폰·컴퓨터·가속기 SKU의 냉각 구성, 지원 소프트웨어, 실제 작업 측정을 추가로 비교해야 합니다. 전체 다이 사양이 모든 판매 제품의 활성 구성을 나타내지는 않습니다.

관련 기록

출처

  1. Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung · 2022-01-18
  2. Exynos 2200 (S5E9925) · Kurnal Insights · 날짜 미제공
  3. Exynos 2400 (S5E9945) · Kurnal Insights · 날짜 미제공
  4. Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung Global Newsroom · 날짜 미제공
  5. Exynos 2200 Product Brief · Samsung Electronics · 날짜 미제공
  6. Exynos 2400 | Mobile Processor · Samsung Semiconductor · 날짜 미제공
  7. Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 · Samsung Global Newsroom · 날짜 미제공
  8. Exynos 2400 embedded Specifications · Samsung Semiconductor · 날짜 미제공
  9. Exynos 2200 — official structured specifications · Samsung Semiconductor · 날짜 미제공
  10. Exynos 2400 — official structured specifications · Samsung Semiconductor · 날짜 미제공

사양 차이는 실측 성능 결과가 아닙니다. 성능 판단에는 출처와 측정 대상 범위가 일치하는 근거가 필요합니다.