VLSI KoreaSamsung Exynos 2200 — annotated die photograph
Samsung Exynos 2200
Samsung의 2022년 플래그십은 Exynos에 Armv9 CPU와 AMD RDNA 2 기반 Xclipse 그래픽을 도입하고, 모바일 하드웨어 레이 트레이싱과 Release 16 5G 모뎀을 추가했습니다.
관련 기술 탐색
사양
33 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Record year | Manufacturer / primary sourceSamsung Scope: SoC design Source date: 2022-01-18 Year basis: announced. This is distinct from source publication and record update. |
| Process label | Manufacturer / primary sourceSamsung Scope: SoC design Source date: 2022-01-18 |
| Announcement date | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Process | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| CPU & clock domains | |
| CPU cores | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| CPU composition | Manufacturer / primary sourceSamsung Scope: SoC design Source date: 2022-01-18 |
| CPU ISA | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| CPU topology | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| CPU prime core | Manufacturer / primary sourceSamsung Electronics Scope: SoC design |
| CPU performance cores | Manufacturer / primary sourceSamsung Electronics Scope: SoC design |
| CPU efficiency cores | Manufacturer / primary sourceSamsung Electronics Scope: SoC design |
| CPU configuration | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Graphics | |
| GPU architecture | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| GPU | Manufacturer / primary sourceSamsung Electronics Scope: SoC design |
| Ray tracing | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Variable rate shading | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| AI & security | |
| NPU configuration | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| NPU precision | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Security | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Memory & interfaces | |
| Memory | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Storage | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Camera, video & display | |
| Maximum camera resolution | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Camera modes | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Video capabilities | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Display | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Camera processing modes | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Video modes | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Video codecs | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design Codec list; not every codec is established at every listed encode/decode mode. |
| Connectivity & devices | |
| Modem | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Modem peak | Manufacturer / primary sourceSamsung Global Newsroom Scope: SoC design |
| Connectivity | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design |
| Modem rates | Manufacturer / primary sourceSamsung Semiconductor Scope: SoC design Theoretical link maxima under supported radio conditions; not an observed network speed. |
| Packaging, power & physical analysis | |
| Reported die area | Published analysisKurnal Insights Scope: SoC design Third-party die-shot measurement (9.69 × 10.8 mm); not a Samsung-disclosed specification. |
시각 자료
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silicon design · Samsung Exynos 2200