SOURCE-LINKED COMPARISON
MediaTek Dimensity 9300 vs Samsung Exynos 2400
CPU description: MediaTek Dimensity 9300 4 × Cortex-X4 + 4 × Cortex-A720; Samsung Exynos 2400 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz. A sourced specification comparison.
MediaTek Dimensity 9300 and Samsung Exynos 2400 are compared as silicon designs in the same soc cohort. CPU description: MediaTek Dimensity 9300 lists 4 × Cortex-X4 + 4 × Cortex-A720; Samsung Exynos 2400 lists 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz. The listed organization describes the documented configuration; it does not rank application speed.
Memory technology: MediaTek Dimensity 9300 lists LPDDR5T; Samsung Exynos 2400 lists LPDDR5X. Storage interface: MediaTek Dimensity 9300 lists UFS 4.0 + MCQ; Samsung Exynos 2400 lists UFS 4.0. GPU description: MediaTek Dimensity 9300 lists Arm Immortalis-G720; Samsung Exynos 2400 lists Xclipse 940. Process label: MediaTek Dimensity 9300 lists Third-generation TSMC 4 nm; Samsung Exynos 2400 lists 4 nm FinFET. Reported die area: MediaTek Dimensity 9300 lists 140.35 mm²; Samsung Exynos 2400 lists 137.4 mm². The GPU and memory descriptions help identify the documented graphics and data interfaces. Reported geometry remains an estimate with its original qualification.
This comparison matches 6 sourced fields across 5 specification sections. 6 fields differ. 10 of 12 field values use manufacturer disclosures; remaining values retain their source evidence class. 11 field values have no publication date in the catalog. There is no matched measured workload benchmark or current price evidence in this page, so it cannot establish a purchase winner, energy-efficiency winner or total system cost.
Documented differences
| Specification / evidence | MediaTek Dimensity 9300silicon-die · soc | Samsung Exynos 2400silicon-die · soc |
|---|---|---|
| CPU descriptionOrganization and listed limits do not establish workload performance. | 4 × Cortex-X4 + 4 × Cortex-A720Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: mediatek-dimensity9300 · All Big Core design | 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, CPU: ‘Cortex-X4 3.2 GHz, Cortex-A720x5 2.9 GHz, Cortex-A520x4 1.95 GHz’ |
| GPU descriptionOrganization and listed limits do not establish workload performance. | Arm Immortalis-G720Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-mtk-9300 · Graphics | Xclipse 940Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 258 |
| Process labelFoundry process names are labels, not equivalent physical dimensions. | Third-generation TSMC 4 nmScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: mediatek-dimensity9300 · Key features | 4 nm FinFETScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, Process: ‘4nm FinFET’ |
| Memory technologyRead the original field scope, conditions and source before comparing. | LPDDR5TScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-mtk-9300 · Memory | LPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Memory row |
| Storage interfaceRead the original field scope, conditions and source before comparing. | UFS 4.0 + MCQScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-mtk-9300 · Storage | UFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Storage row |
| Reported die areaSource-reported geometry; calibration and uncertainty may be unavailable. | 140.35 mm²Scope: silicon-dieEvidence: third-party-reportSource date: 2026-05-19Source: kurnal-mediatek-dimensity-9300 · Dimensions / Area | 137.4 mm²Scope: silicon-dieEvidence: third-party-reportSource date: Not suppliedSource: specs-die2400 · Die-shot Gallery, Dimensions/Area panel |
Who should consider each?
Use this page to study the MediaTek Dimensity 9300 and Samsung Exynos 2400 designs. A device buyer should compare the specific phone, computer or accelerator SKU, cooling configuration, supported software and measured workload. A full-die specification does not describe every enabled commercial configuration.
Related records
- MediaTek Dimensity 9300
- Samsung Exynos 2400
- MediaTek Dimensity 9500
- Samsung Exynos 2500
- Samsung Exynos 2600
Sources
- Kurnal die catalog: MediaTek Dimensity 9300 · Kurnal Insights · 2026-05-19
- Dimensity 9300 · MediaTek · Date not supplied
- Exynos 2400 (S5E9945) · Kurnal Insights · Date not supplied
- MediaTek Dimensity 9300 · MediaTek · Date not supplied
- Exynos 2400 | Mobile Processor · Samsung Semiconductor · Date not supplied
- Exynos 2400 embedded Specifications · Samsung Semiconductor · Date not supplied
- Exynos 2400 — official structured specifications · Samsung Semiconductor · Date not supplied
A specification difference is not a measured workload result. Sources and entity scope must match before drawing performance conclusions.