Collection/MediaTek/MediaTek Dimensity 9300

Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.

Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

SILICON DESIGN / 2023

MediaTek Dimensity 9300

All-big-core flagship with Cortex-X4/A720 CPU, Immortalis-G720 and seventh-generation APU.

MediaTekSoC

Research connections

CompanyMediaTek ↗SeriesMediaTek Dimensity ↗ArchitectureDimensity 9300 ↗ProcessThird-generation TSMC 4 nm ↗

Specifications

13 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceMediaTek Scope: silicon-die Source date: 2023-11-06 Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process	Manufacturer / primary sourceMediaTek Scope: silicon-die
Foundry	Manufacturer / primary sourceMediaTek Scope: silicon-die
CPU & clock domains
CPU	Manufacturer / primary sourceMediaTek Scope: silicon-die
CPU design	Manufacturer / primary sourceMediaTek Scope: silicon-die
Graphics
GPU	Manufacturer / primary sourceMediaTek Scope: silicon-die
AI & security
AI	Manufacturer / primary sourceMediaTek Scope: silicon-die
Memory & interfaces
Memory	Manufacturer / primary sourceMediaTek Scope: silicon-die
Storage	Manufacturer / primary sourceMediaTek Scope: silicon-die
Packaging, power & physical analysis
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-19 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-19 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-19 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Verified die geometry	UnconfirmedMediaTek Scope: silicon-die Source date: 2023-11-06 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.