SEMICONDUCTOR REFERENCE
Applied Materials
Find products, devices, processes and manufacturing tools with specifications and original sources.
Specification query syntax
Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.
Results
equipment
| Compare | Tool / family | Process application | Technology / method | Wafer / substrate | Capability |
|---|---|---|---|---|---|
Semiconductor metrology & inspectionApplied Materials · concept | unresearched | unresearched | unresearched | unresearched |
deposition
| Compare | Tool / family | Process application | Technology / method | Wafer / substrate | Capability |
|---|---|---|---|---|---|
Applied Materials Producer CVDApplied Materials · tool family | dielectric, SiGe and amorphous-silicon filmsProcess application | unresearched | unresearched | unresearched |
CMP
| Compare | Tool / family | Process application | Technology / method | Wafer / substrate | Capability |
|---|---|---|---|---|---|
Applied Materials Mirra CMPApplied Materials · tool family | silicon, STI oxide, polysilicon, tungsten and Cu planarizationProcess application | unresearched | unresearched | unresearched |
bonding surface preparation
| Compare | Tool / family | Process application | Technology / method | Wafer / substrate | Capability |
|---|---|---|---|---|---|
Applied Materials Catalyst CMPApplied Materials · tool family | copper hybrid-bonding surfacesProcess applicationConflicting observations | unresearched | unresearched | unresearched |