VLSI KoreaVLSI MUSEUM / TIMELINE
Follow semiconductor milestones across products, foundry, memory and packaging.
ADVANCED PACKAGING
Advanced packaging timeline
Trace how 2.5D, 3D and hybrid-bonding technologies moved from disclosure toward production platforms.
“When did packaging become a system-performance turning point beyond process scaling?”
Shape, line style and text encode event status.
The same color marks a curated comparison cohort across companies—not physical equivalence.
DATA NOTEOpen an event for its source and date precision. Month, period and year records are plotted as uncertainty bands; future targets use dashed styling.
Data as of 2026.07.15
Read status and evidence before names.
Packaging brands differ in structure, pitch and production readiness; matching colors indicate a comparison cohort, not physical equivalence. The timeline preserves each company’s names while normalizing announcement, development, sampling, risk production, mass production and shipment.
Independent personal research using public sources. Company announcements and future targets retain their original status and verification dates. Methodology & disclosure →