VLSI MUSEUM / ENGINEERING RECORD2023

Huawei / HiSiliconSMIC 7 nm N+2

silicon design

We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.

SILICON DESIGN / 2023

HiSilicon Kirin 9000S

TechInsights physically identified the Kirin 9000S in Huawei Mate 60 Pro and attributed fabrication to SMIC’s N+2 process.

Research connections

7 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Analyst catalog release year.
Process	Independent measurementTechInsights Scope: silicon-die
Foundry	Independent measurementTechInsights Scope: silicon-die
Packaging, power & physical analysis
Die area	Independent measurementTechInsights Scope: silicon-die Published direct laboratory measurement. Another source gives 111.28 mm²; boundary/protocol difference is unresolved.
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

THE VISUAL EVIDENCE

0 DOCUMENTED SOURCES

We have not yet identified a reliable public visual source for this record. Suggest a die photograph, package image, paper or manufacturer diagram.

1 SOURCE-LINKED RELATIONSHIPS

Product-series membership; does not assert shared masks or identical silicon.

silicon design · HiSilicon Kirin 9000S