VLSI MUSEUM / ENGINEERING RECORD2020
Huawei / HiSilicon5 nm

silicon design

칩의 기록은 여기서 시작합니다.

이 기록의 신뢰할 수 있는 공개 다이 사진은 아직 확인하지 못했습니다. 신원과 확인된 기술 근거는 계속 탐색할 수 있습니다.

SILICON DESIGN / 2020

HiSilicon Kirin 9000

Kirin 9000은 Huawei의 2020년 5 nm 모바일 플래그십으로, 트랜지스터 153억 개가 문서에 기재되어 있습니다.

관련 기술 탐색

Identity & fabrication
Year
Manufacturer / primary sourceHuawei

Scope: silicon-die

Source date: 2020-11-27

Year identifies first public introduction where a dated launch is available; see record notes for exceptions.

Process
Manufacturer / primary sourceHuawei

Scope: silicon-die

Source date: 2020-11-27

Foundry
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Independent analyst attribution.

Packaging, power & physical analysis
Transistor count
Manufacturer / primary sourceHuawei

Scope: silicon-die

Source date: 2020-11-27

Reported die width
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die height
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die area
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Verified die geometry
UnconfirmedHuawei

Scope: silicon-die

Source date: 2020-11-27

No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.

Die area
Independent measurementTechInsights

Scope: One Kirin 9000 silicon die, comparative laboratory value

TechInsights provides this value as the comparator in its Kirin 9000S laboratory findings. Width, height and die-edge convention are not supplied.

이 칩의 근거를 더해 주세요.

이 기록의 신뢰할 수 있는 공개 시각 자료는 아직 확인하지 못했습니다. 다이 사진·패키지 이미지·논문·제조사 도해를 제안할 수 있습니다.

기록의 신원과 범위

silicon design · HiSilicon Kirin 9000