VLSI Korea
AMD Ryzen 7 5800X3D — I/O die specimen
VLSI MUSEUM / ENGINEERING RECORDUNDATED
AMD7 nm
sku
The engineering record starts here.
We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.
SKU / DATE NOT RECORDED
AMD Ryzen 7 5800X3D 3.4 GHz 8-Core AM4
CPU SKU · AMD Ryzen 7
Research connections
Specifications
18 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Record scope | Published analysisBuildCores community Scope: product-model |
| Part numbers | Published analysisBuildCores community Scope: product-model |
| Series | Published analysisBuildCores community Scope: product-model |
| Architecture | Published analysisBuildCores community Scope: product-model |
| Process | Published analysisBuildCores community Scope: product-model Source process label; mixed chiplet processes and marketing names retained. |
| CPU & clock domains | |
| Core family | Published analysisBuildCores community Scope: product-model |
| Cores | Published analysisBuildCores community Scope: product-model |
| Threads | Published analysisBuildCores community Scope: product-model |
| Performance cores | Published analysisBuildCores community Scope: product-model |
| Base clock | Published analysisBuildCores community Scope: product-model |
| Boost clock | Published analysisBuildCores community Scope: product-model |
| Cache hierarchy | |
| L2 cache | Published analysisBuildCores community Scope: product-model |
| L3 cache | Published analysisBuildCores community Scope: product-model |
| Memory & interfaces | |
| Memory types | Published analysisBuildCores community Scope: product-model |
| Maximum memory | Published analysisBuildCores community Scope: product-model |
| Packaging, power & physical analysis | |
| Socket | Published analysisBuildCores community Scope: product-model |
| Listed TDP | Published analysisBuildCores community Scope: product-model Source-listed thermal design rating; not measured workload power. |
| Product packaging | Published analysisBuildCores community Scope: product-model |
Photographed specimens
1 PHOTOGRAPHSThe original photographer identifies these specimens with this product. Each photograph keeps its own die, layer and preparation scope.
THE VISUAL EVIDENCE
0 DOCUMENTED SOURCESVisual sources
Help document this silicon.
We have not yet identified a reliable public visual source for this record. Suggest a die photograph, package image, paper or manufacturer diagram.
Follow the connections
1 SOURCE-LINKED RELATIONSHIPSChipwise identifies the photographed I/O die with Ryzen 7 5800X3D. The I/O die is distinct from the compute die and stacked cache.
Chipwise / NanoPhysics · EvidenceRecord identity & scope
sku · AMD Ryzen 7 5800X3D 3.4 GHz 8-Core AM4