VLSI Korea
Zen4
VLSI MUSEUM / ENGINEERING RECORD2023
AMDTSMC 5nm FinFET, TSMC 6nm FinFET
sku
The engineering record starts here.
We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.
SKU / 2023
AMD Ryzen 7 7800X3D
CPU SKU · Ryzen 7 7000
Research connections
CompanyAMD ↗SeriesRyzen 7 7000 ↗ArchitectureZen 4 ↗ProcessTSMC 5nm FinFET, TSMC 6nm FinFET ↗SocketAM5 ↗
WikiChip archive references
Matched archive addresses are research leads. Capture metadata alone does not verify a specification; field-level evidence is listed below.
amd/ryzen 7/7800x3d · 2025-04-16 ↗Specifications
20 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Record scope | Published analysisBuildCores community Scope: product-model |
| Part numbers | Published analysisBuildCores community Scope: product-model |
| Release year | Published analysisBuildCores community Scope: product-model |
| Series | Published analysisBuildCores community Scope: product-model |
| Architecture | Published analysisBuildCores community Scope: product-model |
| Process | Published analysisBuildCores community Scope: product-model Source process label; mixed chiplet processes and marketing names retained. |
| CPU & clock domains | |
| Core family | Published analysisBuildCores community Scope: product-model |
| Cores | Published analysisBuildCores community Scope: product-model |
| Threads | Published analysisBuildCores community Scope: product-model |
| Base clock | Published analysisBuildCores community Scope: product-model |
| Boost clock | Published analysisBuildCores community Scope: product-model |
| Cache hierarchy | |
| L2 cache | Published analysisBuildCores community Scope: product-model |
| L3 cache | Published analysisBuildCores community Scope: product-model |
| Memory & interfaces | |
| Memory types | Published analysisBuildCores community Scope: product-model |
| Memory channels | Published analysisBuildCores community Scope: product-model |
| Maximum memory | Published analysisBuildCores community Scope: product-model |
| Packaging, power & physical analysis | |
| Socket | Published analysisBuildCores community Scope: product-model |
| Listed TDP | Published analysisBuildCores community Scope: product-model Source-listed thermal design rating; not measured workload power. |
| Listed PPT | Published analysisBuildCores community Scope: product-model |
| Product packaging | Published analysisBuildCores community Scope: product-model |
Photographed specimens
1 PHOTOGRAPHSThe original photographer identifies these specimens with this product. Each photograph keeps its own die, layer and preparation scope.
THE VISUAL EVIDENCE
0 DOCUMENTED SOURCESVisual sources
Help document this silicon.
We have not yet identified a reliable public visual source for this record. Suggest a die photograph, package image, paper or manufacturer diagram.
Follow the connections
1 SOURCE-LINKED RELATIONSHIPSThe photographer identifies this specimen with the linked product name. This does not assert that every unit or revision has identical silicon, or that a die photograph depicts the full processor package.
Wikimedia Commons · FritzchensFritz · EvidenceRecord identity & scope
sku · AMD Ryzen 7 7800X3D