Intel’s 2014 process uses second-generation tri-gate FinFETs. The manufacturer disclosed 42 nm fin pitch, 70 nm gate pitch and 52 nm interconnect pitch; these physical dimensions are distinct from the 14 nm generation name. Intel identified Core M as the first product manufactured on the process and reported volume production in August 2014. This entry describes that dated process implementation, without assigning those pitches to every later Intel 14 nm variant.
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