IDENTIFY / MARKINGS & ALIASES

What silicon is this?

Look up exact or partial names, part numbers and documented aliases.

Matching records

40 candidate records across the Museum. A name or alias match does not verify an unknown physical specimen.

001 / DIE PHOTOGRAPH

Fontside view of the IO chip of the AMD Ryzen 7 5800 X3D

AMDUNDATED

AMD Ryzen 7 5800X3D — I/O die specimen

AMD Ryzen 7 5800X3D — I/O die specimen

Image courtesy of Chipwise ·Used with permission

001 / CONTAINING-PRODUCT PHOTOGRAPH

iPhone 15 Pro disassembly photograph

AppleUNDATED

Apple iPhone 15 Pro — teardown specimen

Apple iPhone 15 Pro — teardown specimen

Image courtesy of Chipwise ·Used with permission

001 / BOARD / MODULE PHOTOGRAPH

Annotated iPhone 8 motherboard

AppleUNDATED

Apple iPhone 8 — motherboard specimen

Apple iPhone 8 — motherboard specimen

Image courtesy of Chipwise ·Used with permission

001 / DIE PHOTOGRAPH

Broadcom BCM2712 die shot C0/C1 stepping

BroadcomUNDATED

Broadcom BCM2712 — C0/C1 stepping

Broadcom BCM2712 — C0/C1 stepping

Image courtesy of Chipwise ·Used with permission

001 / DIE PHOTOGRAPH

Broadcom BCM2712 D0 stepping dieshot

BroadcomUNDATED

Broadcom BCM2712 — D0 stepping

Broadcom BCM2712 — D0 stepping

Image courtesy of Chipwise ·Used with permission

001 / PACKAGE CROSS-SECTION

Broadcom BCM2712 embedded package cross-section

BroadcomUNDATED

Broadcom BCM2712 — package cross-section specimen

Broadcom BCM2712 — package cross-section specimen

Image courtesy of Chipwise ·Used with permission

001 / ANNOTATED DIE PHOTOGRAPH

Apple A18 and A18 Pro comparison collage

AppleUNDATED

Apple A18 and A18 Pro — comparison photograph

Apple A18 and A18 Pro — comparison photograph

Image courtesy of Chipwise ·Used with permission

001 / ANNOTATED DIE PHOTOGRAPH

Broadcom BCM2712 C0 versus D0 die comparison

BroadcomUNDATED

Broadcom BCM2712 — C0 and D0 comparison photograph

Broadcom BCM2712 — C0 and D0 comparison photograph

Image courtesy of Chipwise ·Used with permission

001 / PACKAGE CROSS-SECTION

Optical package cross-section on a circuit board

UnidentifiedUNDATED

Optical package cross-section on a circuit board — Chipwise specimen

Optical package cross-section on a circuit board — Chipwise specimen

Image courtesy of Chipwise ·Used with permission

001 / PACKAGE CROSS-SECTION

CoWoS / 3DFabric package cross-section

UnidentifiedUNDATED

CoWoS / 3DFabric package cross-section — Chipwise specimen

CoWoS / 3DFabric package cross-section — Chipwise specimen

Image courtesy of Chipwise ·Used with permission

001 / DIE PHOTOGRAPH

Silicon die with visible TMND33 die mark

UnidentifiedUNDATED

Silicon die with visible TMND33 die mark — Chipwise specimen

Silicon die with visible TMND33 die mark — Chipwise specimen

Image courtesy of Chipwise ·Used with permission

001 / PREPARED SPECIMEN PHOTOGRAPH

Mounted chip specimen prepared for microscopy

UnidentifiedUNDATED

Mounted chip specimen prepared for microscopy — Chipwise specimen

Mounted chip specimen prepared for microscopy — Chipwise specimen

Image courtesy of Chipwise ·Used with permission

Photo-assisted identification is unavailable without a configured vision provider. No file upload or automatic identity assignment is offered.