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반도체 컬렉션 탐색
제품·소자·공정·제조 장비의 사양과 원문 출처를 찾아보세요.
사양 조건 검색 문법
cores·threads·clock·boost·l2·l3·tdp·memory·year에 =, >=, <=, >, < 조건을 사용합니다. 기본 단위: GHz, MB, W, GB. 미확인·상충 값은 수치 조건에 포함하지 않습니다.
검색 결과
cpu
| Compare | Entity | CPU organization | Clock / peak | Cache | Process label | Die area |
|---|---|---|---|---|---|---|
AMD Zen 2 CCDAMD · silicon die · 2019 | 2 CCXsCCXs per CCDphysical core-complex die | unresearched | 16 MBMaximum L3 per CCXphysical core-complex die | unresearched | 74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure | |
Intel 4004Intel · silicon die · 1971 | unresearched | unresearched | unresearched | 10 µmProcess labelprocessor design | unresearched | |
Intel 8086Intel · silicon die · 1978 | unresearched | unresearched | unresearched | 3 µmProcess labelprocessor design | unresearched | |
MOS Technology 6502MOS Technology · silicon die · 1975 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel386 DXIntel · product family · 1985 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel Pentium 60/66 MHzIntel · silicon die · 1993 | unresearched | unresearched | unresearched | 0.8 µmProcess labeloriginal 60/66 MHz models | unresearched | |
AMD Ryzen 5 3600AMD · product model · 2019 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched | |
AMD Ryzen 5 5600XAMD · product model · 2020 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched |
gpu
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA GeForce 256NVIDIA · silicon die · 1999 | unresearched | unresearched | unresearched | unresearched | unresearched | |
NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022 | unresearched | unresearched | unresearched | unresearched | 814 mm²Die areaOne full GH100 silicon die powering H100 |
specimen
| Compare | Entity | Subject | Package | Die area |
|---|---|---|---|---|
AMD Zen 3 CCD specimenAMD · physical specimen | unresearched | unresearched | unresearched |
accelerator
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA A100NVIDIA · silicon die · 2020 | unresearched | unresearched | unresearched | unresearched | 826 mm²Die areaOne GA100 silicon die powering A100 |
사양 비교
출처의 값·조건·대상 범위를 함께 비교합니다.
| Specification / evidence | Samsung Exynos 1480silicon-die | Samsung Exynos 2200silicon-die |
|---|---|---|
| Process | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| GPU | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU configuration | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| NPU configuration | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Memory | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Storage | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Display | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Camera processing modes | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Video modes | official-disclosure · sourcedScope: silicon-dieSource ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Video codecs | official-disclosure · sourcedScope: silicon-dieCodec list; not every codec is established at every listed encode/decode mode.Source ↗ | official-disclosure · sourcedScope: SoC designCodec list; not every codec is established at every listed encode/decode mode.Source ↗ |
| Connectivity | official-disclosure · sourcedScope: silicon-dieManufacturer connectivity/interface support; integration scope depends on the complete platform.Source ↗ | official-disclosure · sourcedScope: SoC designSource ↗ |
| Modem rates | official-disclosure · sourcedScope: silicon-dieTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗ | official-disclosure · sourcedScope: SoC designTheoretical link maxima under supported radio conditions; not an observed network speed.Source ↗ |
| Record year | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Year basis: announced. This is distinct from source publication and record update.Source ↗ |
| Process label | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ |
| CPU cores | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU composition | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource date: 2022-01-18Source ↗ |
| GPU architecture | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Announcement date | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU ISA | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU topology | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU prime core | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU performance cores | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| CPU efficiency cores | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Ray tracing | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Variable rate shading | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| NPU precision | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Maximum camera resolution | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Camera modes | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Video capabilities | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Modem | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Modem peak | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Security | Unresearched for this record | official-disclosure · sourcedScope: SoC designSource ↗ |
| Reported die area | Unresearched for this record | third-party-report · sourcedScope: SoC designThird-party die-shot measurement (9.69 × 10.8 mm); not a Samsung-disclosed specification.Source ↗ |
실측 벤치마크는 워크로드·버전·구성·전력 모드·날짜가 필요합니다. 이론 최고치와 제조사 주장은 실측 결과가 아닙니다.