SOURCE-LINKED COMPARISON
Samsung Exynos 2400 vs Samsung Exynos 2600
CPU description: Samsung Exynos 2400 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz; Samsung Exynos 2600 1 + 3 + 6. A sourced specification comparison.
Samsung Exynos 2400 and Samsung Exynos 2600 are compared as silicon designs in the same soc cohort. CPU cores: Samsung Exynos 2400 lists 10; Samsung Exynos 2600 lists 10. CPU description: Samsung Exynos 2400 lists 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHz; Samsung Exynos 2600 lists 1 + 3 + 6. The listed organization describes the documented configuration; it does not rank application speed.
Memory technology: Samsung Exynos 2400 lists LPDDR5X; Samsung Exynos 2600 lists LPDDR5X. Storage interface: Samsung Exynos 2400 lists UFS 4.0; Samsung Exynos 2600 lists UFS 4.1. NPU configuration: Samsung Exynos 2400 lists AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSP; Samsung Exynos 2600 lists 32K MAC. Process label: Samsung Exynos 2400 lists 4 nm FinFET; Samsung Exynos 2600 lists 2 nm GAA. Reported die area: Samsung Exynos 2400 lists 137.4 mm²; Samsung Exynos 2600 lists 141.16 mm². The GPU and memory descriptions help identify the documented graphics and data interfaces. Reported geometry remains an estimate with its original qualification.
This comparison matches 11 sourced fields across 7 specification sections. 8 fields differ. 20 of 22 field values use manufacturer disclosures; remaining values retain their source evidence class. 21 field values have no publication date in the catalog. There is no matched measured workload benchmark or current price evidence in this page, so it cannot establish a purchase winner, energy-efficiency winner or total system cost.
Documented differences
| Specification / evidence | Samsung Exynos 2400silicon-die · soc | Samsung Exynos 2600silicon-die · soc |
|---|---|---|
| NPU configurationRead the original field scope, conditions and source before comparing. | AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · AI row | 32K MACScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| DisplayRead the original field scope, conditions and source before comparing. | 4K/WQUXGA @120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Display row | 4K / WQUXGA at up to 120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Maximum camera resolutionRead the original field scope, conditions and source before comparing. | 320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 247-248, 279-281 | 320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Video codecsRead the original field scope, conditions and source before comparing. | HEVC (H.265), VP9, AV1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video Codec row | HEVC, H.264, VP9, AV1, APVScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| CPU coresOrganization and listed limits do not establish workload performance. | 10Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-272 | 10Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| CPU descriptionOrganization and listed limits do not establish workload performance. | 1× Cortex-X4 at 3.2 GHz + 5× Cortex-A720 at 2.9 GHz + 4× Cortex-A520 at 1.95 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, CPU: ‘Cortex-X4 3.2 GHz, Cortex-A720x5 2.9 GHz, Cortex-A520x4 1.95 GHz’ | 1 + 3 + 6Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| GPU descriptionOrganization and listed limits do not establish workload performance. | Xclipse 940Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 258 | Samsung Xclipse 960Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Process labelFoundry process names are labels, not equivalent physical dimensions. | 4 nm FinFETScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, Process: ‘4nm FinFET’ | 2 nm GAAScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Memory technologyRead the original field scope, conditions and source before comparing. | LPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Memory row | LPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Storage interfaceRead the original field scope, conditions and source before comparing. | UFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Storage row | UFS 4.1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-exynos2600 · Product specifications |
| Reported die areaSource-reported geometry; calibration and uncertainty may be unavailable. | 137.4 mm²Scope: silicon-dieEvidence: third-party-reportSource date: Not suppliedSource: specs-die2400 · Die-shot Gallery, Dimensions/Area panel | 141.16 mm²Scope: silicon-dieEvidence: third-party-reportSource date: 2026-05-29Source: kurnal-samsung-exynos-2600 · Dimensions / Area |
Who should consider each?
Use this page to study the Samsung Exynos 2400 and Samsung Exynos 2600 designs. A device buyer should compare the specific phone, computer or accelerator SKU, cooling configuration, supported software and measured workload. A full-die specification does not describe every enabled commercial configuration.
Related records
Sources
- Kurnal die catalog: Samsung Exynos 2600 · Kurnal Insights · 2026-05-29
- Exynos 2400 (S5E9945) · Kurnal Insights · Date not supplied
- Exynos 2400 | Mobile Processor · Samsung Semiconductor · Date not supplied
- Exynos 2400 embedded Specifications · Samsung Semiconductor · Date not supplied
- Exynos 2400 — official structured specifications · Samsung Semiconductor · Date not supplied
- Exynos 2600 — product overview and specifications · Samsung Semiconductor · Date not supplied
A specification difference is not a measured workload result. Sources and entity scope must match before drawing performance conclusions.