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SOURCE-LINKED COMPARISON

Samsung Exynos 2400 vs Samsung Exynos 2500

GPU description: Samsung Exynos 2400 Xclipse 940; Samsung Exynos 2500 fourth-generation Xclipse 950. A sourced specification comparison.

Samsung Exynos 2400 and Samsung Exynos 2500 are compared as silicon designs in the same soc cohort. CPU cores: Samsung Exynos 2400 lists 10; Samsung Exynos 2500 lists 10. CPU peak clock: Samsung Exynos 2400 lists 3.2 GHz; Samsung Exynos 2500 lists 3.3 GHz. The listed organization describes the documented configuration; it does not rank application speed.

Memory technology: Samsung Exynos 2400 lists LPDDR5X; Samsung Exynos 2500 lists LPDDR5X. Storage interface: Samsung Exynos 2400 lists UFS 4.0; Samsung Exynos 2500 lists UFS 4.0. NPU configuration: Samsung Exynos 2400 lists AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSP; Samsung Exynos 2500 lists AI engine with 24K MAC NPU(2-GNPU+2-SNPU) and DSP. Process label: Samsung Exynos 2400 lists 4 nm FinFET; Samsung Exynos 2500 lists 3 nm Gate-All-Around (GAA). GPU description: Samsung Exynos 2400 lists Xclipse 940; Samsung Exynos 2500 lists fourth-generation Xclipse 950. The GPU and memory descriptions help identify the documented graphics and data interfaces. Process names and nominal limits require their original source context.

This comparison matches 19 sourced fields across 8 specification sections. 5 fields differ. 38 of 38 field values use manufacturer disclosures; remaining values retain their source evidence class. 38 field values have no publication date in the catalog. There is no matched measured workload benchmark or current price evidence in this page, so it cannot establish a purchase winner, energy-efficiency winner or total system cost.

Documented differences

Specification / evidenceSamsung Exynos 2400silicon-die · socSamsung Exynos 2500silicon-die · soc
NPU configurationRead the original field scope, conditions and source before comparing.AI engine with 17K MAC NPU(2-GNPU+2-SNPU) and DSPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · AI rowAI engine with 24K MAC NPU(2-GNPU+2-SNPU) and DSPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · AI row
Camera processing modesRead the original field scope, conditions and source before comparing.Single camera 320MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+32MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Camera (Rear) rowSingle camera 320MP (Max), Single camera 108MP @30 fps, Dual camera 64MP+32MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Camera (Rear) row
DisplayRead the original field scope, conditions and source before comparing.4K/WQUXGA @120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Display row4K/WQUXGA @120 HzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Display row
Maximum camera resolutionRead the original field scope, conditions and source before comparing.320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 247-248, 279-281320 MPScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · imaging section
Video codecsRead the original field scope, conditions and source before comparing.HEVC (H.265), VP9, AV1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Video Codec rowHEVC (H.265), VP9, AV1Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Video Codec row
ConnectivityRead the original field scope, conditions and source before comparing.GNSSScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Connectivity rowGNSSScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Connectivity row
Modem peak downlinkRead the original field scope, conditions and source before comparing.9.6 Gbps FR1; 12.1 Gbps FR2Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 2909.6 Gbps FR1; 12.1 Gbps FR2Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · connectivity section
Modem ratesRead the original field scope, conditions and source before comparing.5G NR Sub-6GHz 9.64 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 12.1 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Modem row5G NR Sub-6GHz 9.64 Gbps (DL), 2.55 Gbps (UL) / 5G NR mmWave 12.1 Gbps (DL), 3.67 Gbps (UL) / LTE Cat.24 8CA 3 Gbps (DL), Cat.22 4CA 422 Mbps (UL)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Modem row
Modem standardRead the original field scope, conditions and source before comparing.5G NR 3GPP Release 17Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 2905G NR 3GPP Release 17Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · connectivity section
CPU coresOrganization and listed limits do not establish workload performance.10Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-27210Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · CPU section
CPU peak clockOrganization and listed limits do not establish workload performance.3.2 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, CPU: ‘Cortex-X4 3.2 GHz’3.3 GHzScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500spec · embedded Specifications API, CPU: ‘Cortex-X925 3.3 GHz’
CPU topologyOrganization and listed limits do not establish workload performance.tri-cluster deca-coreScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 234-238, 271-2721+7+2Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · CPU section
GPU architectureOrganization and listed limits do not establish workload performance.AMD RDNA 3Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400preview · first-glimpse sectionAMD RDNA 3Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · graphics section
GPU descriptionOrganization and listed limits do not establish workload performance.Xclipse 940Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · line 258fourth-generation Xclipse 950Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · graphics section
Ray tracingRead the original field scope, conditions and source before comparing.hardware-acceleratedScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 219-221, 256-258hardware-acceleratedScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · benefits and graphics sections
Process labelFoundry process names are labels, not equivalent physical dimensions.4 nm FinFETScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400spec · embedded Specifications API, Process: ‘4nm FinFET’3 nm Gate-All-Around (GAA)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · benefits and power-efficiency sections
Memory technologyRead the original field scope, conditions and source before comparing.LPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Memory rowLPDDR5XScope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Memory row
Storage interfaceRead the original field scope, conditions and source before comparing.UFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2400-table · Storage rowUFS 4.0Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2500-table · Storage row
Package technologyRead the original field scope, conditions and source before comparing.Fan-out Wafer Level Package (FOWLP)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2400 · lines 272, 276-278Fan-out Wafer Level Package (FOWLP)Scope: silicon-dieEvidence: official-disclosureSource date: Not suppliedSource: specs-s2500 · power-efficiency section

Who should consider each?

Use this page to study the Samsung Exynos 2400 and Samsung Exynos 2500 designs. A device buyer should compare the specific phone, computer or accelerator SKU, cooling configuration, supported software and measured workload. A full-die specification does not describe every enabled commercial configuration.

Related records

Sources

  1. Exynos 2400 | Mobile Processor · Samsung Semiconductor · Date not supplied
  2. Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023 · Samsung Global Newsroom · Date not supplied
  3. Exynos 2400 embedded Specifications · Samsung Semiconductor · Date not supplied
  4. Exynos 2500 | Mobile Processor · Samsung Semiconductor · Date not supplied
  5. Exynos 2500 embedded Specifications · Samsung Semiconductor · Date not supplied
  6. Exynos 2400 — official structured specifications · Samsung Semiconductor · Date not supplied
  7. Exynos 2500 — official structured specifications · Samsung Semiconductor · Date not supplied

A specification difference is not a measured workload result. Sources and entity scope must match before drawing performance conclusions.