SEMICONDUCTOR REFERENCE

E-2200

Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

Company

Subtype / application

Entity type

Family

Process label

Architecture

Imagery

14 recordsSort

cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
Xeon E-2236Intel · product model · 2019	6Cores	3400 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area
Xeon E-2234Intel · product model · 2019	4Cores	3600 MHzBase clock	1 MiBL2 cache	14 nmProcess	126 mm²Die area
Xeon E-2286MIntel · product model · 2019	8Cores	2400 MHzBase clock	2 MiBL2 cache	14 nmProcess	174 mm²Die area
Xeon E-2276MIntel · product model · 2019	6Cores	2800 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area
Xeon E-2288GIntel · product model · 2019	8Cores	3700 MHzBase clock	2 MiBL2 cache	14 nmProcess	174 mm²Die area
Xeon E-2286GIntel · product model · 2019	6Cores	4000 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area
Xeon E-2278GIntel · product model · 2019	8Cores	3400 MHzBase clock	2 MiBL2 cache	14 nmProcess	174 mm²Die area
Xeon E-2276GIntel · product model · 2019	6Cores	3800 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area
Xeon E-2274GIntel · product model · 2019	4Cores	4000 MHzBase clock	1 MiBL2 cache	14 nmProcess	126 mm²Die area
Xeon E-2246GIntel · product model · 2019	6Cores	3600 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area
Xeon E-2244GIntel · product model · 2019	4Cores	3800 MHzBase clock	1 MiBL2 cache	14 nmProcess	126 mm²Die area
Xeon E-2226GIntel · product model · 2019	6Cores	3400 MHzBase clock	1.5 MiBL2 cache	14 nmProcess	149.6 mm²Die area

E-2200

Results

cpu