SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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Subtype / application

Entity type

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Architecture

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cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
Ryzen 3 4300GEAMD · product model · 2020	4Cores	3500 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 3 4300UAMD · product model · 2020	4Cores	2700 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 3 PRO 4450UAMD · product model · 2020	4Cores	2500 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 3 4300GAMD · product model · 2020	4Cores	3800 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 3 PRO 4350GAMD · product model · 2020	4Cores	3800 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 3 PRO 4350GEAMD · product model · 2020	4Cores	3500 MHzBase clock	2 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 PRO 4650GAMD · product model · 2020	6Cores	3700 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 4600GEAMD · product model · 2020	6Cores	3300 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 PRO 4650GEAMD · product model · 2020	6Cores	3300 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 4500UAMD · product model · 2020	6Cores	2300 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 4600HAMD · product model · 2020	6Cores	3000 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area
Ryzen 5 4600HSAMD · product model · 2020	6Cores	3000 MHzBase clock	3 MiBL2 cache	7 nmProcess	156 mm²Die area

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cpu