VLSI KoreaProduct-series membership only; it does not assert shared masks or identical silicon.
Qualcomm · EvidenceDie photograph · X
Qualcomm Snapdragon 888 (SM8350 Lahaina) — die shot
SILICON DESIGN / 2020
Qualcomm Snapdragon 888
Qualcomm’s 5 nm mobile SoC, announced in 2020 with a Kryo 680 CPU, Adreno 660 GPU, Hexagon 780 processor, Spectra 580 triple ISP and integrated X60 5G modem. The Modem-RF and FastConnect platform capabilities also involve companion components.
Research connections
Specifications
14 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Announcement date | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 |
| Part number | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| Process | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 |
| CPU & clock domains | |
| CPU | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| CPU peak frequency | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| Graphics | |
| GPU | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| AI & security | |
| AI processor | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| AI performance | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 Advertised sixth-generation Qualcomm AI Engine aggregate; not a standalone Hexagon-only throughput or measured application result. |
| Memory & interfaces | |
| Memory technology | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| Maximum memory density | Manufacturer / primary sourceQualcomm Scope: silicon-die |
| Camera, video & display | |
| ISP | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 |
| Connectivity & devices | |
| Modem-RF | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 Platform/system capability. This does not place all RF or connectivity components on the SoC die. |
| Wi-Fi connectivity | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 Platform/system capability. This does not place all RF or connectivity components on the SoC die. |
| Additional specifications | |
| Commercial availability | Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2020-12-01 Qualcomm’s stated availability expectation; it is not a claim for every phone model. |
THE VISUAL EVIDENCE
1 DOCUMENTED SOURCESVisual sources
Die photographs shared by their authors on X. Open a post to explore its images and discussion.
Kurnal · @Kurnalsalts · View the post above ↑Follow the connections
1 SOURCE-LINKED RELATIONSHIPSRecord identity & scope
silicon design · Qualcomm Snapdragon 888