컬렉션/Qualcomm/Qualcomm Snapdragon 8 Gen 5

Dieshot of Qualcomm’s Snapdragon 8 gen 5

Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.

Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

SILICON DESIGN / 2025

Qualcomm Snapdragon 8 Gen 5

X80 5G와 Wi-Fi 7을 갖춘 3 nm Oryon 기반 플랫폼입니다.

QualcommSoC

사양

14 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2025-11-26 Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process	Manufacturer / primary sourceQualcomm Scope: silicon-die
Foundry	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-25 Independent analyst attribution.
CPU & clock domains
CPU	Manufacturer / primary sourceQualcomm Scope: silicon-die
CPU peak frequency	Manufacturer / primary sourceQualcomm Scope: silicon-die
Graphics
GPU	Manufacturer / primary sourceQualcomm Scope: silicon-die
AI & security
AI	Manufacturer / primary sourceQualcomm Scope: silicon-die
Connectivity & devices
Modem	Manufacturer / primary sourceQualcomm Scope: silicon-die
Wi-Fi	Manufacturer / primary sourceQualcomm Scope: silicon-die
Packaging, power & physical analysis
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-25 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-25 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-02-25 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Verified die geometry	UnconfirmedQualcomm Scope: silicon-die Source date: 2025-11-26 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.
Additional specifications
Peak CPU frequency	Manufacturer / primary sourceQualcomm Scope: silicon-die Source date: 2025-11-26