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Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.
SILICON DESIGN / 2023
Qualcomm Snapdragon 8 Gen 3 4 nm Snapdragon flagship with Kryo CPU, Adreno graphics, Hexagon AI and X75 5G.
Specifications 11 SOURCE-LINKED FIELDS Identity & fabrication CPU & clock domains Graphics AI & security Camera, video & display Connectivity & devices Packaging, power & physical analysis Identity & fabrication Year 2023 Scope: silicon-die
Source date: 2023-10-24
Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process 4 nm Scope: silicon-die
Foundry Unresearched Scope: silicon-die
Source date: 2023-10-24
No foundry attribution accepted from inspected sources.
CPU & clock domains CPU Qualcomm Kryo Scope: silicon-die
CPU peak frequency Up to 3.4 GHz; 3.3 GHz and 3.0 GHz versions also listed Scope: silicon-die
Current product-page variants; check the device specification for its actual platform version.
Graphics GPU Qualcomm Adreno Scope: silicon-die
AI & security AI Qualcomm Hexagon NPU Scope: silicon-die
Camera, video & display ISP triple 18-bit Scope: silicon-die
Connectivity & devices Modem Snapdragon X75 5G Modem-RF Scope: silicon-die
Connectivity FastConnect 7800 Scope: silicon-die
Packaging, power & physical analysis Verified die geometry Unresearched Scope: silicon-die
Source date: 2023-10-24
No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.
Suggest a correction Enter the full die exhibit
Follow the connections 2 SOURCE-LINKED RELATIONSHIPS Overview Sources & history Discussion
Record identity & scope silicon design · Qualcomm Snapdragon 8 Gen 3
What this photograph shows Snapdragon 8 gen 3. Frontside die view, as identified by source
VLSI Korea
