VLSI KoreaProduct-series membership; does not assert shared masks or identical silicon.
MediaTek · 근거Die photograph · X
MediaTek Dimensity 9500 — annotated die photograph and comparisons
SILICON DESIGN / 2025
MediaTek Dimensity 9500
Dimensity 9500은 2025년 플래그십 제품 주기를 위해 TSMC N3P와 3세대 올 빅 코어 CPU 구성을 사용합니다.
MediaTekSoC
관련 기술 탐색
사양
5 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Year | Manufacturer / primary sourceMediaTek Scope: silicon-die Source date: 2025-09-22 Year identifies first public introduction where a dated launch is available; see record notes for exceptions. |
| Process | Manufacturer / primary sourceMediaTek Scope: silicon-die |
| Foundry | Manufacturer / primary sourceMediaTek Scope: silicon-die |
| CPU & clock domains | |
| CPU design generation | Manufacturer / primary sourceMediaTek Scope: silicon-die Source date: 2025-09-22 |
| Packaging, power & physical analysis | |
| Verified die geometry | UnconfirmedMediaTek Scope: silicon-die Source date: 2025-09-22 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled. |
THE VISUAL EVIDENCE
1 개의 확인된 출처시각 자료
작성자가 X에 공유한 다이 사진입니다. 원문에서 사진과 토론을 자세히 볼 수 있습니다.
Kurnal · @Kurnalsalts · 위의 게시물 보기 ↑근거가 있는 연결
1 SOURCE-LINKED RELATIONSHIPS기록의 신원과 범위
silicon design · MediaTek Dimensity 9500