silicon design
The engineering record starts here.
We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.
Research connections
Specifications
5 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Record year | Manufacturer / primary sourceIBM Scope: processor design Source date: 2020-08-17 Year basis: announced; systems expected in 2021. This is distinct from source publication and record update. |
| Process label | Manufacturer / primary sourceIBM Scope: processor design Source date: 2020-08-17 |
| AI & security | |
| AI engine | Manufacturer / primary sourceIBM Scope: processor design Source date: 2020-08-17 |
| Memory & interfaces | |
| Memory encryption | Manufacturer / primary sourceIBM Scope: processor design Source date: 2020-08-17 |
| Packaging, power & physical analysis | |
| Die area | Manufacturer / primary sourceBLIS Retreat 2020, UT Austin; IBM/CMU speaker Scope: One POWER10 silicon die Original IBM/CMU speaker page at BLIS Retreat 2020; area excludes the single/dual-chip socket or module. Public IBM Redbooks search extracts independently corroborate 602 mm², but no PDF was downloaded. |
Visual sources
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Record identity & scope
silicon design · IBM POWER10