VLSI KoreaProduct-series membership; does not assert shared masks or identical silicon.
TechInsights · EvidenceVLSI MUSEUM / ENGINEERING RECORD2024
Huawei / HiSiliconSMIC 7 nm N+2
silicon design
The engineering record starts here.
We have not yet identified a reliable public die photograph for this record. Its identity and documented evidence remain open to explore.
SILICON DESIGN / 2024
HiSilicon Kirin 9020
The Kirin 9020 in Mate 70 Pro+ was independently identified as another SMIC N+2 implementation.
Research connections
Specifications
7 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Year | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Analyst catalog release year; not a dated Huawei launch announcement. |
| Process | Independent measurementTechInsights Scope: silicon-die |
| Foundry | Independent measurementTechInsights Scope: silicon-die |
| Packaging, power & physical analysis | |
| Reported die width | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die height | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die area | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Verified die geometry | UnconfirmedTechInsights Scope: silicon-die No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled. |
THE VISUAL EVIDENCE
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1 SOURCE-LINKED RELATIONSHIPSRecord identity & scope
silicon design · HiSilicon Kirin 9020