Kirin 9010 Dieshot Layout

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Kirin 9010 Dieshot LayoutKurnal @Kurnalsalts · View original post on X
SILICON DESIGN / 2024

HiSilicon Kirin 9010

Kirin 9010 is a later SMIC N+2 mobile design, documented through independent physical analysis.

Research connections

Identity & fabrication
Year
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Analyst catalog release year; not a dated Huawei launch announcement.

Process
Independent measurementTechInsights

Scope: silicon-die

Foundry
Independent measurementTechInsights

Scope: silicon-die

Packaging, power & physical analysis
Reported die width
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die height
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die area
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Verified die geometry
UnconfirmedTechInsights

Scope: silicon-die

No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.

Die photographs shared by their authors on X. Open a post to explore its images and discussion.

Kurnal · @Kurnalsalts · View the post above ↑

Record identity & scope

silicon design · HiSilicon Kirin 9010