VLSI KoreaVLSI MUSEUM / ENGINEERING RECORD2014
Intel22 nm
sku
칩의 기록은 여기서 시작합니다.
이 기록의 신뢰할 수 있는 공개 다이 사진은 아직 확인하지 못했습니다. 신원과 확인된 기술 근거는 계속 탐색할 수 있습니다.
관련 기술 탐색
사양
19 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Record scope | Published analysisBuildCores community Scope: product-model |
| Part numbers | Published analysisBuildCores community Scope: product-model |
| Release year | Published analysisBuildCores community Scope: product-model |
| Series | Published analysisBuildCores community Scope: product-model |
| Architecture | Published analysisBuildCores community Scope: product-model |
| Process | Published analysisBuildCores community Scope: product-model Source process label; mixed chiplet processes and marketing names retained. |
| CPU & clock domains | |
| Core family | Published analysisBuildCores community Scope: product-model |
| Cores | Published analysisBuildCores community Scope: product-model |
| Threads | Published analysisBuildCores community Scope: product-model |
| Base clock | Published analysisBuildCores community Scope: product-model |
| Boost clock | Published analysisBuildCores community Scope: product-model |
| Cache hierarchy | |
| L2 cache | Published analysisBuildCores community Scope: product-model |
| L3 cache | Published analysisBuildCores community Scope: product-model |
| Memory & interfaces | |
| Memory types | Published analysisBuildCores community Scope: product-model |
| Memory channels | Published analysisBuildCores community Scope: product-model |
| Maximum memory | Published analysisBuildCores community Scope: product-model |
| Packaging, power & physical analysis | |
| Socket | Published analysisBuildCores community Scope: product-model |
| Listed TDP | Published analysisBuildCores community Scope: product-model Source-listed thermal design rating; not measured workload power. |
| Product packaging | Published analysisBuildCores community Scope: product-model |
THE VISUAL EVIDENCE
0 개의 확인된 출처시각 자료
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기록의 신원과 범위
sku · Intel Xeon E5 2697 V3