컬렉션/Apple/Apple A18

Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.

Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

SILICON DESIGN / 2024

Apple A18

6코어 CPU와 5코어 GPU를 갖춘 2세대 3 nm iPhone SoC입니다.

AppleSoC

사양

12 SOURCE-LINKED FIELDS

Identity & fabrication
Year	Manufacturer / primary sourceApple Scope: silicon-die Source date: 2024-09-09 Year identifies first public introduction where a dated launch is available; see record notes for exceptions.
Process	Manufacturer / primary sourceApple Scope: silicon-die
Foundry	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Independent analyst attribution.
CPU & clock domains
CPU	Manufacturer / primary sourceApple Scope: silicon-die
Graphics
GPU	Manufacturer / primary sourceApple Scope: silicon-die
Ray tracing	Manufacturer / primary sourceApple Scope: silicon-die
AI & security
Neural Engine cores	Manufacturer / primary sourceApple Scope: silicon-die Source date: 2024-09-09
Neural Engine	Manufacturer / primary sourceApple Scope: silicon-die
Packaging, power & physical analysis
Reported die width	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die height	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Reported die area	Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.
Verified die geometry	UnconfirmedApple Scope: silicon-die Source date: 2024-09-09 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.