Apple A17 pro SoC dieshotExplore photograph
Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.
Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

SILICON DESIGN / 2023

Apple A17 Pro

Apple’s 3 nm iPhone 15 Pro SoC adds a six-core GPU and hardware ray tracing.

Research connections

Identity & fabrication
Year
Manufacturer / primary sourceApple

Scope: silicon-die

Source date: 2023-09-12

Year identifies first public introduction where a dated launch is available; see record notes for exceptions.

Process
Manufacturer / primary sourceApple

Scope: silicon-die

Foundry
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Independent analyst attribution.

CPU & clock domains
CPU
Manufacturer / primary sourceApple

Scope: silicon-die

Graphics
GPU cores
Manufacturer / primary sourceApple

Scope: silicon-die

Ray tracing
Manufacturer / primary sourceApple

Scope: silicon-die

AI & security
Neural Engine
Manufacturer / primary sourceApple

Scope: silicon-die

Packaging, power & physical analysis
Reported die width
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die height
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Reported die area
Published analysisKurnal Insights

Scope: silicon-die

Source date: 2026-05-05

Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty.

Verified die geometry
UnconfirmedApple

Scope: silicon-die

Source date: 2023-09-12

No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled.

Hosted image provenance · 4
Die photographHosted in Museum

Apple A17 Pro — Die photograph

Chipwise / NanoPhysics

1,200 × 790 pxTechnical archive / analysis

Apple A17 Pro. See source caption; no chip layer inferred beyond source evidence

View original die photo
Rights, provenance & link history
Rights status
PERMISSION GRANTED
Local hosting / thumbnails / hotlinking
Allowed / Allowed / Not enabled
Attribution
Image courtesy of Chipwise · Used with permission
Identity / confidence
matched / high
Evidence reviewed
2026-09-09
Link checked
2026-09-09 · ok · HTTP 200
Reuse evidence ↗

Access to a source does not grant permission to reproduce its images.

Die photographHosted in Museum

Apple A17 Pro — Die photograph

Chipwise / NanoPhysics

800 × 526 pxTechnical archive / analysis

Apple A17 Pro. Frontside die view, as identified by source

View original die photo
Rights, provenance & link history
Rights status
PERMISSION GRANTED
Local hosting / thumbnails / hotlinking
Allowed / Allowed / Not enabled
Attribution
Image courtesy of Chipwise · Used with permission
Identity / confidence
matched / high
Evidence reviewed
2026-09-09
Link checked
2026-09-09 · ok · HTTP 200
Reuse evidence ↗

Access to a source does not grant permission to reproduce its images.

Die photographHosted in Museum

Apple A17 Pro — Die photograph

Chipwise / NanoPhysics

800 × 512 pxTechnical archive / analysis

Apple A17 Pro. See source caption; no chip layer inferred beyond source evidence

View original die photo
Rights, provenance & link history
Rights status
PERMISSION GRANTED
Local hosting / thumbnails / hotlinking
Allowed / Allowed / Not enabled
Attribution
Image courtesy of Chipwise · Used with permission
Identity / confidence
matched / high
Evidence reviewed
2026-09-09
Link checked
2026-09-09 · ok · HTTP 200
Reuse evidence ↗

Access to a source does not grant permission to reproduce its images.

Die photographHosted in Museum

Apple A17 Pro — Die photograph

Chipwise / NanoPhysics

1,300 × 832 pxTechnical archive / analysis

Apple A17 Pro, source label TMQG36. Backside/deprocessed die view, as identified by source

View original die photo
Rights, provenance & link history
Rights status
PERMISSION GRANTED
Local hosting / thumbnails / hotlinking
Allowed / Allowed / Not enabled
Attribution
Image courtesy of Chipwise · Used with permission
Identity / confidence
matched / high
Evidence reviewed
2026-09-09
Link checked
2026-09-09 · ok · HTTP 200
Reuse evidence ↗

Access to a source does not grant permission to reproduce its images.

Enter the full die exhibit

Record identity & scope

silicon design · Apple A17 Pro

What this photograph shows

Apple A17 Pro. See source caption; no chip layer inferred beyond source evidence