GALLERY / REAL SILICON

An extraordinary little world.

Die, wafer, package and board photographs, plus clearly labeled educational diagrams. Each image retains its source and license.

Intel 8086 PACKAGE PHOTOGRAPH
Intel C8086 ceramic DIP package, marked C8086 / S2864. Exterior view; the internal die is not visible.
1920 × 1280 PX SOURCE / 100%
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Thomas Nguyen (Stelo.xyz / Pttn) ·CC BY-SA 4.0· Package photograph · Resized and re-encoded; no content altered.
Origin & contributions

Original source · Retrieved 2026-09-11

Thomas Nguyen (Stelo.xyz / Pttn) · photographer · Included in this image

Credit Thomas Nguyen (Stelo.xyz / Pttn) and link source and CC BY-SA 4.0. Resized and re-encoded by VLSI Museum; derivatives remain CC BY-SA 4.0.

Intel C8086 ceramic DIP package, marked C8086 / S2864. Exterior view; the internal die is not visible.

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