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작고 경이로운 세계.

다이·웨이퍼·패키지·보드 사진과 명확히 구분한 교육용 구조도입니다. 이미지마다 출처와 라이선스를 확인할 수 있습니다.

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AMD Ryzen 7 5800X3D — I/O die specimen SEM IMAGE
FIB cross sectional view 14 nm proces node
Image courtesy of Chipwise ·Used with permission
1920 × 1368 PX SOURCE / 100%
드래그로 이동
Image courtesy of Chipwise ·Used with permission· SEM image · Resized and format-converted for display; original image content and watermarks preserved.
Origin & contributions

Original source · Retrieved 2026-09-09

Chipwise / NanoPhysics · photographer · Included in this image

Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.

AMD Ryzen 7 5800X3D I/O die. See source caption; no chip layer inferred beyond source evidence

Source photography; preparation and visible markings are preserved. This photograph supplies no independently verified geometric measurements.

원본과 고해상도
60 장의 ZeptoBars 원본기술 노트: 한 패키지의 두 다이출처와 외부 참고 자료
299 장
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