SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
Ryzen 3 2200UAMD · product model · 2018	2Cores	2500 MHzBase clock	1 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 3 PRO 2300UAMD · product model · 2018	4Cores	2000 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 3 2300UAMD · product model · 2018	4Cores	2000 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 5 2500UAMD · product model · 2017	4Cores	2000 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 5 PRO 2500UAMD · product model · 2018	4Cores	2000 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 7 2700UAMD · product model · 2017	4Cores	2200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 7 PRO 2700UAMD · product model · 2018	4Cores	2200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area

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cpu